Global semiconductor packaging materials market to near $30bn by 2027

High-performance applications, 5G, AI and the adoption of heterogeneous integration and system-in-package technologies are increasing demand for advanced packaging solutions. The development of new materials and processes to enable chips with higher transistor density and greater reliability are also contributing to market growth.

"The semiconductor packaging materials industry is undergoing significant changes as new technologies and applications are driving demand for more advanced and diverse materials," said Jan Vardaman, President and Founder of TechSearch International. "Advances in dielectric materials and underfill are driving strong demand for fan-in and fan-out wafer level packaging, flip chip, and 2.5D/3D packaging. New substrate technologies such as silicon interposers and organic interposers using Re-Distribution Layer are also key growth drivers of packaging solutions. At the same time, research on laminate substrates with finer features continues with the development of glass cores for build-up substrates."

The Global Semiconductor Packaging Materials Outlook report provides a comprehensive analysis of the current and forecast market for semiconductor packaging materials, covering substrates, leadframes, bonding wires, encapsulation materials, underfill materials, die attach, wafer level package dielectrics, and wafer-level plating chemicals.

Features of the report include:

• Technology trends
• Regional market size
• Five-year market forecast to 2027
• Market size in revenue and units
• Excel workbook file summarizing market information
• Supplier market share
• Capacity and utilisation trends

The report is available for purchase from SEMI.