Embedded PCM for automotive MCUs begin sampling

These MCUs will target powertrain systems, advanced and secure gateways, safety/ADAS applications, and Vehicle Electrification.

With more demanding automotive applications, constraints on processing power, power consumption mitigation, and larger memory requirements are pushing for new automotive MCU architectures. One of the most challenging demands is for larger embedded memories as firmware complexity and size increase dramatically.

ePCM presents a solution to these chip- and system-level challenges, meeting automotive requirements for AEC-Q100 Grade 0, operating at temperature up to +165°C. In addition, ST's technology assures firmware/data retention through high temperature soldering reflow processes and immunity to radiation, for additional data safety.

ST presented an update on the architecture and performance of a 16Mb ePCM array for a 28nm FD-SOI automotive MCU at the 2018 International Electron Devices Meeting (IEDM) in San Francisco on 4th December.

"Having applied ST's process, design, technology, and application expertise to ePCM, we've developed an innovative recipe that makes ST the very first to combine this non-volatile memory with 28nm FD-SOI for high performance, low power automotive microcontrollers," said Marco Monti, President Automotive and Discrete Group, STMicroelectronics.

"With samples already in some lead-customers' hands, we're confirming the outstanding temperature performance of ePCM and its ability to meet all automotive standards, further assuring our confidence in its market adoption and success."