Microsemi High Temperature Flash Memory Products Withstand Environmental Challenges of Deeper Oil and Gas Drilling

They can withstand the temperature, shock and vibration challenges encountered by drilling equipment thousands of feet below the surface.

Our company has been providing high-reliability microelectronics for decades, said BJ Heggli, vice president of strategic development and assistant general manager for Microsemi. We understand the importance of high-reliability operation under tough conditions, which is why our products are subjected to stringent design, characterization and testing processes. Our company has unique capabilities to address the increased needs for higher density and temperature and we are excited about the launch of the first of several downhole product offerings.

The oil and gas industries are increasingly turning to unexplored areas as conventional sources of oil and gas decline. The high temperatures and pressures often found in these areas present complex challenges to the microelectronics used on drilling equipment. A substantial percentage of breakdowns in downhole systems is caused by failures in the electronics.

About High Temperature Flash
The new NOR flash product line is available in hermetic ceramic dual inline (DIP) small outline J-lead, (SOJ), flatpacks, ceramic quad flat pack (CQFP), or pin grid array (PGA) packages, and in 1 megabit (Mb), 4Mb and 16Mb densities.

Microsemi has full design, manufacture and test capabilities for a wide variety of Multiple Chip Packages (MCPs), commercial-off-the-shelf (COTS) memory, microprocessors and combination MCPs for demanding applications. These microelectronic products can also be customized for special requirements.