Modules integrate NAND chips fabricated with 19nm technology
Toshiba have today unveiled a 32-gigabyte embedded device which integrates four 64Gbit (equal to 8GB) NAND chips fabricated with 19nm second generation process technology. Measuring only 11.5 x 13 x 1.0mm, it also comes with a dedicated controller.
This new product launch meets the growing demand for large density NAND flash memory chips that can support high resolution video and deliver enhanced storage. This demand is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs.Fulfilling this demand, the 128GB module can record up to 2,222 hours of music at a 128Kbps bit rate, 16.6 hours of full spec high definition video and 38.4 hours of standard definition video
THe is compliant with JEDEC e・MMC Version 5.0, published by JEDEC in September, and achieves a high read/write performance by applying the new HS400 high speed interface standard. Toshiba will bring the NAND chips to a line-up of single-package embedded NAND flash memories in densities from 4GB to 128GB. All will integrate a controller to manage basic control functions for NAND applications. Further to this, the e•MMC V5.0 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.
The new product is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. Mass production will start from the end of November.
New Product Line-up
|
Product Name |
Capacity |
Package |
Mass Production |
|
THGBMBG8D4KBAIR |
32GB |
153Ball FBGA |
End of November, 2013 |
|
THGBMBG7D2KBAIL |
16GB |
153Ball FBGA |
End of November, 2013 |
Following 16GB and 32GB products, Toshiba will release 4GB, 8GB, 64GB and 128GB products in turn.
Key Specifications
Product Name |
THGBMBG8D4KBAIR |
THGBMBG7D2KBAIL |
|
Interface |
JEDEC e•MMCTM V5.0 standard HS-MMC interface |
||
Capacity |
32GB |
16GB |
|
Power Supply Voltage |
1.7V~1.95V / 2.7V~3.6V (Interface) |
||
Bus Width |
x1 / x4 / x8 |
||
Write Speed |
90MB per sec. (Sequential/HS400 Mode) |
50MB per sec. (Sequential/HS400 Mode) |
|
Read Speed |
270MB per sec. (Sequential/HS400 Mode) |
270MB per sec. (Sequential/HS400 Mode) |
|
Temperature Range |
-25degrees to +85degees Celsius
|
||
Package |
153Ball FBGA |
153Ball FBGA |