Memory

Module suitable for low power embedded applications

6th June 2017
Alice Matthews
0

A Qseven Rel. 2.1 compliant module has been released by SECO. The Q7-B03 is based on the Intel Atom E39xx family, Intel Celeron N3350 and Intel Pentium N4200 SoCs. This solution can merge its high graphics performance and extreme temperature with power efficiency. and is available from Rutronik. The graphics of the Q7-B03 module include an integrated Gen9-LP graphics controller with 18 execution units, as well as 4K HW decoding and encoding of HEVC (H.265), H.264, VP8, SVC and MVC.

It comes with a dual channeled soldered down DDR3L-1866 memory of up to 8GB and 2x external SATA Gen3 channel, SD interface as well as optional eMMC disc soldered onboard. The module features a wide connectivity capability. It supports the operating systems Windows 10 Enterprise (64bit), Windows 10 IoT Core, Linux and Yocto, Android support is planned.

With dimensions of 70x70mm (2.76x2.76”) and a wide temperature range of -45 to 80°C, the Q7-B03 module is particularly suitable for low power embedded applications, such as HMI, digital signage/infotainment, multimedia, visual computing and industrial IoT.

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