KIOXIA sampling UFS Ver. 4.0 embedded flash memory

Supported in capacities of 256 gigabytes (GB), 512GB, and one terabyte (TB), the new products are well suited for a variety of next-generation mobile applications, including cutting-edge smartphones.

The enhanced performance of the new UFS products provides optimal utilisation of 5G connectivity, resulting in accelerated downloads, minimised latency, and an enhanced user experience. A smaller package size contributes to board space efficiency and design flexibility.

Key Features include: • Read/write speed improvement over previous generation: approx. +15% sequential write, +50% random write and +30% random read. • Package size reduction over previous generation: Package size is nine mm x 13 mm and package thickness is 0.8 mm (256GB and 512GB) and 0.9 mm (1TB), resulting in an approx. 18% reduction compared to conventional package size (11 mm x 13 mm).

KIOXIA was the first to introduce UFS technology and continues to develop new products. The latest UFS Ver. 4.0 devices integrate the company’s innovative BiCS FLASH 3D flash memory and a controller in a JEDEC standard package. UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and supports theoretical interface speeds of up to 23.2 gigabits per second (Gbps) per lane or 46.4 Gbps per device. UFS 4.0 is backward compatible with UFS 3.1.

"KIOXIA’s UFS technology is the 'racehorse equivalent' of the company's family of embedded storage devices. With our next-generation UFS 4.0, we have doubled the random write and increased random reads by 30%," said Axel Störmann, Vice President and Chief Technology Officer for Embedded Memory and SSD, KIOXIA Europe GmbH. "As development continues, we are proud to help accelerate mobile communication."

Sample shipments for the 256 and 512GB products begin this month, with the 1TB offering following in June 2024.