New Intel Xeon D-Series boosts Edge Computing performance

These three modules offer application developers scalability and flexibility for high-end edge computing.

The COMh-sdID Server Module, measuring 160 x 160mm with scalability ranging from four to 20 cores, features 4x DIMM sockets supporting up to 512GB DDR4 memory at 3200 MT/s. Optionally, a soldered NVMe SSD onboard with up to one TByte storage capacity is available as a storage medium. It boasts 48x PCIe lanes (32x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces, supporting up to 100Gbit Ethernet, providing extensive interface and communication options.

In ‘Size D small’ format, the COM-HPC Server Module COMh-sdIL, with dimensions of 120 x 160mm, is even more compact than the standard COM-HPC Size D design (160 x 160mm). With all components soldered, the module is highly resistant to shock and vibration, making it ideal for outdoor applications. Equipped with 16x PCIe Gen4 plus 16x PCIe Gen3 lanes and a maximum of 64GB soldered DDR4 memory at 2933 MT/s, it offers a soldered NVMe SSD onboard with up to one TByte storage capacity as an optional storage medium.

The COM-Express basic COMe-bID7, based on the Intel Xeon D-1800 processor, offers scalability from four to 10 cores in a small form factor, enabling robust and space-saving implementations in harsh environments and under extreme conditions. The module features up to 4x SO-DIMM sockets supporting a maximum of 128GB memory. Optionally, a soldered NVMe SSD onboard with up to one TByte storage capacity is available. With 16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR interfaces, it provides ideal support for high data throughput rates in challenging I/O and network structures.

Robust and scalable high-performance modules

All three modules are equipped with SKUs for operation in an extended industrial temperature range of –40°C to +85°C and ensuring 24/7 reliability for 10 years. These features ensure robust implementations for harsh environments and extreme conditions within a small mechanical footprint. With scalable performance, complemented by Intel QuickAssist Technology (QAT) and AI acceleration with Intel AVX-512, the modules are perfectly suited for use in complex AI applications, high-performance network platforms, and edge servers. Featuring real-time capabilities, low latency, and determinism with Intel Time Coordinated Computing (TCC) and Time Sensitive Networking (TSN), these platforms are ideal for high-performance IoT edge computing applications.