New advanced packaging 3D CT AXI solution

The TR7600F3D SII Plus’s technology integrates a next-generation 110kv X-ray source, 3 – 25µm High Multi-Resolution, AI-powered inspection algorithms, elevating defect detection to unparalleled levels of precision.

The SEMI 3D CT AXI equipment ensures meticulous inspection across various components, including BGA, QFN, SiP, PTH, PoP, Wire, and Die Bond, setting a new industry standard for comprehensive analysis. The 3D AXI TR7600F3D SII Plus is designed for the inspection of High-reliability electronics manufacturing industries such as Advanced Packaging, Automotive, Aerospace, and Medical. The SEMI 3D CT AXI can precisely inspect the IC packaging interconnect, such as Micro Bumps.

The TR7600F3D system features EtherCAT for enhanced connectivity and Smart Board Warpage Control, ensuring precise board alignment. The TR7600F3D SII Plus integrates with Smart Factory production lines and the MES of your choice, ensuring compatibility and future-proofing your production processes. The newly released AXI supports current Smart Factory Standards, including the IPC-CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).