Made in Germany – Distributed Manufacturing project

The secure supply of electronic components is of growing strategic importance for Germany as an industrial location. The increasing relocation of integrated circuit manufacturing to non-European regions increases the vulnerability to the introduction of malware and espionage functions into components supplied by contract manufacturers (foundries). At the same time, the risk of intellectual property theft of circuit designs by third parties is increasing.

The 'Distributed Manufacturing for Novel and Trusted Electronics T4T' project aims to provide domestic industry with tools to access secure supply chains and trusted electronics. Subcomponents adapted to these requirements can still be accessed via existing supply chains (split manufacturing), but the assembly and encoding of the systems will take place in a trusted environment at the German site.

The new technical requirements of this split-manufacturing approach to packaging technology are to be visualized with the aid of various demonstrators. These will illustrate new design flows and methods, adapted manufacturing processes and the individual technical know-how of the project partners involved.

In addition to Bosch, Osram, Audi and XFAB, these include NanoWired, Suess, DISCO and IHP as well as the Fraunhofer Institutes IZM-ASSID, IPMS, IIS/EAS and the Technical University of Dresden. The knowledge gained from the project is intended to make a structural contribution to the standardisation of processes in packaging and interconnection technology and, to this end, define new design specifications and tolerance rules for offset and structure sizes.