KIC presents Contact-less Thermal AnalysisTM

In response to the dynamic demands of today's manufacturing environment, where maintaining the highest level of quality and process control is paramount, KIC proudly introduces NEW SENSOR TECHNOLOGY. This technology, Contact-less Thermal AnalysisTM, directly measures board temperatures during production, marking an advancement in electronics manufacturing.

KIC’s Contact-less Thermal AnalysisTM directly measures board temperature at the end of the heated section of the reflow oven during production. This capability enables real-time monitoring of temperature and convection changes, representing a monumental leap in reflow process inspection technology.

Benefits of the new sensing technology

Precision redefined: directly measuring board temperature and heat transfer changes ensures unparalleled precision and quality in reflow profiles, monitoring all aspects of the oven's influence on production boards.

Combined board-level temperatures: KIC RPI employs advanced algorithms, considering board temperature and ambient temperature at the board level, to determine temperature, time, and convection changes impacting the reflow profile.

Seamless integration: the RPI system actively tracks process Cpk, providing critical temperature profile data that seamlessly integrates with other MES factory automation systems, SPI, and AOI data.

The Future of electronics manufacturing

Discover the future of electronics manufacturing with KIC's advanced RPI systems equipped with Contact-less Thermal AnalysisTM.

Visit KIC at the 2024 IPC APEX EXPO to engage with thermal process experts, learn more about this technology, and explore solutions for soldering and curing processes in electronics manufacturing, and semiconductor advanced packaging.

Visit KIC at Booth 1626.