Use a complete Wi-Fi/Bluetooth combo module to simplify IoT connectivity

This is also seen in wireless Internet of Things (IoT) connectivity. Designing and fabricating wireless functions, even for low-volume applications, tends to be the domain of a few RF ‘magicians’. These include specialists who can design circuits to work at a few hundred megahertz and the companies that manufacture them, often at a relatively high cost. Lately, I have been amazed by the ready availability of complete gigahertz (GHz)-range RF ICs that can help to quickly implement highly sophisticated wireless connectivity at a low cost, in a tiny footprint, and with extraordinary functionality. 

Of course, ‘complete’ is often interpreted differently by the vendor and the user. While every active device needs a power source and, most likely, some bypass capacitors, designers may also have to add more active and passive components for successful operation. Complete is, therefore, a function of which components and how many. 

Complete modules simplify regulatory compliance 

For RF related functions, device completeness is more than just a convenience. A complete RF solution can eliminate two of the biggest challenges of RF design: 

These design issues become more complicated when the wireless link circuit and function must support multiple versions of a single standard, such as the many Wi-Fi variants (IEEE 802.11xx). It is more challenging when it must support different standards, such as Bluetooth. Even seasoned designers are cautious about developing a full-function RF link to meet a single industry standard; meeting multiple wireless standards in one chip is an even riskier proposition. 

Modules deliver the complete solution 

A way around all this is to opt for Murata Electronics’ Type 2BZ (LBEE5XV2BZ-883), a dual-band 2.4 and 5GHz Wi-Fi wireless local area network (WLAN), and Bluetooth transceiver module. This combo solution supports Wi-Fi 802.11a/b/g/n/ac with 2×2 multiple input, multiple output (MIMO), as well as Bluetooth 5.2 basic rate (BR), enhanced data rate (EDR), and low energy (LE). Its physical layer (PHY) data rate is up to 866 megabits per second (Mbps) for Wi-Fi and 3 Mbps for Bluetooth. 

Target applications include size and power-sensitive devices such as IoT nodes, handheld wireless systems, home automation, gateways, and others that must meet FCC/CE/IC/TELEC standards. The fully shielded surface-mount module weighs just 0.36g, has a footprint of only 11.4 × 8.9mm, and a height of 1.4mm (Figure 1). 

Figure 1. The fully shielded LBEE5XV2BZ-883 is a combo transceiver module for Wi-Fi and Bluetooth that simplifies wireless connectivity implementation. (Image source: Murata Electronics) 

The LBEE5XV2BZ is based on Infineon Technologies’ AIROC CYW54590 system on chip (SoC). The CYW54590 includes the transmitter RF power amplifiers (PAs) and receiver low-noise amplifiers (LNAs) (Figure 2). The module addresses critical RF matching, filtering, and antenna interfacing issues. As such, it removes the many challenges associated with creating and certifying an RF circuit and related software. 

Figure 2. The Type 2BZ module is based on the CYW54590 Wi-Fi 5 and Bluetooth 5.1 combo SoC with onboard PAs and LNAs. (Image source: Infineon Technologies)