Single-chip custom solutions provide optimised Edge computing

ASICs based on the SmartEdge Platform provide a competitive advantage over multi electronic component solutions by delivering higher performance and reduced system power through increased integration, while also lowering the total BoM cost. 

According to recent industry reports, more than half of the data usage in IoT is now  processed at the Edge by autonomous devices. These devices typically require sensitive sensor AFEs (Analogue Front Ends) coupled to data converters, microcontrollers running complex embedded software, with security and some form of wired or wireless communications interface. Bringing all of these functions together, often with the need for local calibration and low-latency real time control, represents a significant design and integration challenge. 

The SmartEdge Platform provides a cost-effective way to integrate sensing, calibrating, controlling and communication functions into a single ASIC. This level of integration delivers higher overall performance, particularly when moving between the analogue and digital domains, while also bringing down the system power budget. For autonomous edge devices expected to operate for many years from a single battery, a SmartEdge solution will provide significant benefits.

“We understand the challenges of developing IoT edge devices that operate within a performance window and power budget,” said Darren Hobbs, Director of Marketing and Strategy, S3 Semiconductors. “The SmartEdge Platform enables OEMs to create an optimised single-chip solution that meets their specific requirements while offering significant engineering and commercial advantages over existing, non-optimal solutions.”

To find out more, S3 Semiconductors will be in hall 3/3-230 at Embedded World 2018, and you can attend the company's paper at Session 33 on Thursday 1st March.