Kontron's next-gen Intel atom modules
Kontron, a global provider of IoT/Embedded Computer Technology (ECT), is introducing three product lines based on the next generation of Intel Atom processors, becoming available in the forthcoming months: COM Express Compact Type 6 with COMe-cAS6, COM Express Mini Type 10 with COMe-mAS10, and SMARC module with SMARC-sXAS.
All three platforms support the broad scalability of the new Intel Atom series x7000E/x7000RE, Intel Processor N Series, and Intel Core i3-N305 processor designed for IoT applications. The range extends from the cost-optimised 2-core to high-performance 8-core Intel Core i3 solution with up to 3.8 GHz burst frequency.
Support for Intel AVX2 and Intel Deep Learning Boost – in combination with up to 32 execution units (EUs) – delivers accelerated deep learning inference and media processing. With up to eight cores on Intel Atom processors x7000RE series and on Intel Core i3 processor, plus support for DDR5/LPDDR5 memory and expanded I/Os, the processors are up to 1.30x faster in single-threaded performance and up to 1.09x faster in multi-thread performance compared to the previous generation.
IoT enhancements deliver critical capabilities like hardware virtualisation, multi-OS support, plus Intel Time Coordinated Computing (Intel TCC), 2.5GbE Time-Sensitive Networking, and real-time computing to the platform.
The COMe-cAS6 provides up to 16 Gigabyte of DDR5-4800 memory via one SODIMM memory socket, supports up to four displays, six PCIe 3.0 lanes, up to four USB 3.2 Gen2/2.0, four USB 2.0 interfaces, two SATA ports, one 2.5 GBASE-T Ethernet with TSN and optional eMMC flash.
The COMe-mAS10 for space-saving system solutions supports up to 16 Gigabyte LPDDR5-4800 memory-down, four PCIe 3.0 lanes, two USB 3.2 Gen2 and six USB 2.0 interfaces, two SATA ports, eMMC on-board, one 1GBASE-T (alternatively 2.5GBASE-T) Ethernet port with TSN.
The SMARC sXAS is particularly suitable for applications requiring low height. It offers up to 16 Gigabyte of LPDDR5-4800 memory down, two USB 3.2 Gen2 and four USB 2.0 interfaces, one SATA port, eMMC on-board, two 1GBASE-T (alternatively 2.5GBASE-T) Ethernet ports with TSN.
The new generation comes with unrivalled performance and high energy efficiency resulting in an impressive performance-per-watt ratio. The energy-saving compact modules can be used in fanless applications, suitable for rugged, industrial, and real-time environments.
Typical areas of application are IoT gateways, control computers, and input devices in industrial environments, rugged mobile applications as well as Point-of-Sale (POS), Point-of-Interest (POI), kiosk systems and digital signage solutions.
All three module solutions provide industrial-grade-by-design versions specified for industrial temperature operation from –40 to +85°C, with in-band ECC memory as well as long-term availability of ten years or more to meet the specific requirements of applications for the defence and transportation market. The modules come with BSP support for Windows 10 (later Windows 11) IoT Enterprise LTSC, Linux.