IP leverages nm process to push IoT integration boundaries

The IoT IP subsystems in development include small, highly-integrated connected solutions for simple sensors which combine an entry-level M-class MIPS CPU with an ultra-low power Ensigma Whisper RPU for low-power WiFi, Bluetooth Smart and 6LowPan, as well as OmniShield multi-domain hardware enforced security, and on-chip RAM and flash. The advanced RF and embedded flash capabilities from TSMC enable Imagination to push the boundaries of IoT integration.

At the higher end, highly-integrated and sophisticated audio and vision sensors will be a key component of future mutual customers’ SoCs for a wide range of IoT applications such as smart surveillance, retail analytics and autonomous vehicles. As part of the collaboration, Imagination and TSMC are working together to realise reference IP subsystems that bring together Imagination’s PowerVR multimedia IP, MIPS CPUs, Ensigma RPUs and OmniShield technology to create highly-integrated, highly-intelligent connected audio and vision sensor IP platforms.

These IP subsystems will leverage advanced features such as GPU compute, power-managed CPU clusters and on-chip high-bandwidth communications, demonstrating that high-performance local processing and connectivity can be integrated efficiently and cost-effectively.

Imagination’s IP families include OmniShield-enabled PowerVR multimedia IP, enabling GPU and video decoding/encoding, complemented by innovative camera imaging processors, OmniShield-enabled MIPS CPUs, Ensigma Radio Connectivity Processors (RPUs), including high-performance Explorer WiFi/Bluetooth on-chip IP and Whisper ultra-low power sensor IP, FlowCloud device-to-cloud connectivity solutions, Caskeid multiroom streaming audio platform and extensive FlowTalk and ClearCall VoIP technologies.

Tony King-Smith, Executive Vice President of Marketing, ImgTec, commented: “We have been working with TSMC for more than two years on advanced IP subsystems for IoT and other connected products. Many of our licensees rely on TSMC to provide them with leading-edge, low-power, high-performance silicon foundry capabilities. Through our ongoing collaboration with TSMC, we are focused on creating meaningful solutions that will help our mutual customers quickly create differentiated, secure and highly integrated products.”

Suk Lee, Senior Director, Design Infrastructure Marketing Division, TSMC, added: “In order to simplify our customers’ designs and shorten their time-to-market, TSMC and our ecosystem partners are transitioning from chip-design enablers to subsystem enablers. We are working closely with Imagination, an established IP leader, as part of our IoT Subsystem Enablement initiative to help companies get their IoT and connected products to market more quickly and easily.”