Perfect Wireless Interconnect announced by ITT Interconnect Solutions

To meet these constraints and provide an optimum solution for manufacturers, ITT ICS designers created the new Perfect Wireless Interconnect - a 300k psi domed interconnect contact with a minimum of 0.5N of force and 0.60mm of deflection which holds true signal integrity through the antenna. The Perfect Wireless Interconnect has a reduced length to fit tight spacing, yet withstands manufacturing stresses and remains stable on the board. Available in beryllium copper (BeCu) or titanium copper (TiCu), it also features side walls to provide beam protection and a solder well to prevent wicking.

The new Perfect Wireless Interconnect can be used as a SIM, speaker/vibrator, microphone, battery or board-to-board contact for a huge number of wireless hand-held applications, including handsets, smart phones, laptop computers, memory sticks, CT scanning equipment, key fobs and GPS units.