Wireless

Zarlink and LSI Deliver Scalable Synchronization Solution for Wireless Backhaul

11th April 2011
ES Admin
0
Zarlink Semiconductor announces that its platform of Timing over Packet products together with the LSI® Axxia™ Communication Processor family is providing a complete, scalable solution supporting low-cost Ethernet backhaul deployments for wireless service providers.
As smartphone users increasingly send and receive data intense traffic, including video, service providers must deploy Ethernet backhaul solutions to maintain reliable service and lower operating costs, said Jeremy Lewis, product line manager with Zarlink`s Timing and Synchronization group. This scalable solution, with offerings from Zarlink and LSI, speeds time-to-market for manufacturers designing equipment for the fast-growing wireless backhaul market. Using this solution, wireless service providers can economically and efficiently upgrade their networks to support advanced communication services.



The complete timing solution is compliant with the IEEE 1588-2008 standard and has been validated for interoperability. This offering provides timing and synchronization for 3G and LTE base stations, as well as emerging backhaul networks using boundary clock, enabling TDM infrastructure to be replaced with low-cost Ethernet based backhaul. Zarlink's ZL3034x devices and the LSI Axxia Communication Processor family provide combined 1588 & SyncE Hybrid mode, which is in increasing demand from service providers due to its synchronization accuracy



This collaboration brings together award-winning traffic management capabilities from LSI and industry-leading packet timing products from Zarlink to deliver a complete and scalable solution for next-generation mobile networks, said Tareq Bustami, multicore communication processor product line director, LSI. With this solution, service providers can deploy Ethernet backhaul to support data-intense communication services while reducing operating costs.

Featured products

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier