WiFi 6 solutions for fixed wireless access applications

With hundreds of thousands of sites deployed globally Airspan is at the forefront of providing mobile operators innovative wireless solutions for high-reliability public and private urban, suburban and rural applications. Offering high-capacity, high-performance solutions that allow operators to rapidly deploy at scale. 

Next-generation Airspan solutions will leverage ON Semiconductor’s QCS-AX Wifi 6 family of chipsets. These products will maximise the benefits of the new standard including the additional spectrum in the 6 GHz band. The OFDMA-based 8x8 beamforming technology will significantly improve noise immunity, while enabling high-spectral efficiency and delivering multi-gigabit capacities, benefiting from the 160 MHz channels with modulation rates of 1024 QAM.

This collective effort enables Airspan to augment the reliability and scalability for Outdoor and FWA deployments using the ON Semiconductor’s Wifi 6 solutions. Next generation Airspan products currently under development will address market demand for high spectral efficiency, interference immunity, and network orchestration capabilities for seamless carrier-grade deployments.

“We are excited to continue expanding on our existing collaboration with ON Semiconductor to deliver solutions to the market that offer an accelerated ROI with advantageous price/performance while guaranteeing network reliability with high capacity to complement our 5G deployment efforts,” said Eric Stonestrom, CEO, Airspan Networks.

“The FWA innovation has expanded Wifi use case into outdoor space. By leveraging Wifi 6 to offload  LTE/5G networks, end consumers can expect fast and seamless connectivity. We are thrilled to continue working with Airspan to bring new connectivity to underserved markets,” added Irvind Ghai, VP Marketing, Quantenna Connectivity Solutions at ON Semiconductor.