Ultrasound technology creates touch-sensitive panels for mobiles

The optimised DSP software library and fully integrated toolchains for processor and software development enabled Sentons to focus on their advanced interface technology and achieve rapid time to market.

“Mobile device manufacturers are seeking new ways to innovate and improve the user interface capabilities in their products. Replacing commodity capacitive technologies with Sentons’ ultrasound-based sensing technology enables the application of touch sensing not only on glass but also on metal and curved surfaces. It also allows force and pressure sensing with zero deformation of the touch surface,” said Sam Sheng, CEO, Sentons. “This technology is centered around sophisticated new algorithms running on the Cadence Tensilica ConnX BB32EP DSP. A powerful 32-way MAC SIMD, 5-issue VLIW DSP with outstanding support for complex vector and matrix advanced algebra, the BB32EP’s high performance and low power were the perfect match for Sentons’ new SoC.”

“Sentons’ highly innovative signal processing was enabled by a Tensilica heterogeneous multicore solution including the ConnX BB32EP and an Xtensa controller that provides outstanding complex signal processing performance in a low-power envelope for mobile applications,” said Chris Jones, Group Director of DSP Marketing at Cadence. “Supported by a complete, industry-proven set of tools and libraries, Tensilica provided an ideal solution for Sentons’ new ultrasound technology.”