Microsemi Delivers Power Amplifier for Next-generation Wi-Fi Applications

“Our new PA is the second in a series of devices we are introducing to accelerate the proliferation of the next-generation Wi-Fi standard,” said Amir Asvadi, vice president and general manager of Microsemi’s Analog and Mixed Signal group. “We will continue to focus on strengthening our 802.11ac portfolio with industry-leading solutions and partnering with world-class WLAN manufacturers to deliver circuits that provide the highest system performance.”

In addition to its power capabilities, the LX5509 features a standardized pin out. This enables customers to, without layout changes, later upgrade the performance level in their systems with higher power 5 GHz PAs that are currently in development at Microsemi.

Microsemi’s 802.11ac solution offerings include the LX5586, the world’s first monolithic silicon germanium (SiGe) RF front-end (FE) device. The company recently announced that this innovative solution works in conjunction with Broadcom’s BCM4335 combo chip for mobile platforms.

The company also offers a broad portfolio of IEEE 802.11a/b/g/n solutions including power amplifiers, low noise amplifiers, front- end modules and reference designs co-developed with leading WLAN chipset manufacturers.

LX5509 Key Features
• 5 GHz operation;
• Linear output power of 19dBm for IEEE 802.11ac 256-QAM 80MHz, EVM < 1.8% @3.3V;
• Linear output power of 20dBm for IEEE 802.11n 64-QAM 20MHz, EVM < 3% @3.3V;
• 28dB OFDM power gain;
• 50-ohm input and output match, eliminating the need to optimize output matching on PCB;
• Integrated harmonic filter and output detector; and
• Temperature-compensated on-chip output power detector with wide dynamic range.

Packaging and Availability
The LX5509 is packaged in a 4 mm x 4 mm quad flat no-lead (QFN) package and is available now for sampling.