Wireless

NTT DOCOMO, NTT Corporation, NEC Corporation, and Fujitsu jointly announced the development of a top-level (1) wireless device capable of ultra-high-speed 100Gbps transmissions in the 100GHz and 300GHz sub-terahertz bands.

Anritsu Corporation has introduced a newly developed Butler Matrix 4 x 4 (0.6GHz to 7.125GHz) MA8114A to expand its Butler Matrix module lineup of simulating MIMO connections.

Radiocrafts’ ultra-low power long range Sub-GHz mesh network, RIIM, stands out for its robustness and efficiency in facilitating wireless communication across vast industrial environments.

STMicroelectronics’ ST25R100 near-field communication (NFC) reader delivers a combination of advanced features, robust communication, and affordability, raising the value of contactless interaction in high-volume consumer and industrial products.

Powercast Corporation, the industry’s one-stop-shop for wireless power, has launched its Extended-Temperature RAIN RFID Reader Module designed to integrate into high-temperature RFID readers that need to reliably operate in the extreme conditions present in automotive, industrial, outdoor, energy, and other applications.

Rutronik is now stocking the improved IR transceiver modules from Vishay.

International communications enabler BICS has launched a new solution to support international SMS on more advanced networks no longer supporting 2G or 3G technologies.

Rural towns and villages in the Lake District have become the first in England to benefit as government delivers on its plan to improve 4G mobile coverage in hard-to-reach areas.  

ADLINK Technology, a global specialist in Edge computing, is proud to launch its latest innovation, the EMU-200 series, an application-ready IIoT gateway that can meet the data network requirements of various harsh application scenarios, including renewable energy, electric vehicle (EV) charging, building management, and factory equipment monitoring.

Silicon Labs, a specialist in secure, intelligent wireless technology for a more connected world, has announced their new xG26 family of Wireless SoCs and MCUs.