Wireless

In the future, many cellular handsets will feature a slot for a removable memory card. Designers can minimize the impact of this feature on handset dimensions by using the EMIF06-mSD02N16 SD Card interface IC just announced by STMicroelectronics.

Laird Technologies has announced the availability of its new SM24513P3 Dual-Band MIMO Internal Antenna. Specifically designed to enhance the latest generation of Wireless LAN (WLAN) technology systems, the SM24513P3 embedded antenna makes use of MIMO technology in which multiple wireless transmitters and receivers operate simultaneously.

Atmel Corporation has announced the release of what it says is the first IEEE P802.15.4c compliant RF transceiver, the AT86RF212, for the Chinese wireless market. The fully integrated transceiver offers a very flexible combination of frequency bands and data rates. Customers can choose operation for Chinese WPAN band from 779 to 787 MHz, European SRD band from 863 to 870 MHz, and North American ISM band from 902 to 928 MHz.

picoChip demonstrated its leadership in femtocell and 4G technology at Mobile World Congress ’09 with the announcement of an eight user HSPA femtocell solution, and demonstrations of both FDD and TDD variants of LTE. picoChip also showcased the PC302, a cost-optimized SoC solution for HSPA femtocells, while its technology was used to power products and demonstrations on more than 20 stands at the show.

Silicon Laboratories has announced a high performance embedded wireless solution, the EZRadioPRO family and C8051F9xx series low-power MCU. The EZRadioPRO embedded wireless radio family delivers the highest single-chip output power (up to +20 dBm) and industry leading sensitivity (-118 dBm), providing a best-in-class link budget that substantially increases communication range while minimizing power consumption.

Toshiba has announced the TC35893XBG and TC35894XBG flexible I/O expander devices – the newest additions to its mobile peripheral device product portfolio. The TC35893XBG and TC35894XBG easily allow the addition of I/O peripheral ports so keypads, LEDs, and switches can interface seamlessly within a mobile handset or other portable consumer electronics device.

ReVerb Networks has announced it will build its new line of digital integrated antenna arrays using Axis Network Technology’s WiMAX and LTE Multiple Input Multiple Output – MIMO – digital and RF platform.

Alpha Micro Components has announced the SAGEM HiLoNC module to its portfolio of networking products. The new component is the smallest of its kind and hosts a range of essential features for Machine-to-machine (M2M) applications and is ideal for use in the automotive and security markets.

Fujitsu Microelectronics Europe (FME) has announced the MB86K23, a Mobile WiMAX baseband device targeting the expanding mobile PC market. MB86K23 is the next-generation of the successful MB86K21, which targeted embedded WiMAX in mobile PCs or in WiMAX PC cards and which has been certified by the WiMAX Forum.

The joint venture that united the wireless semiconductor division of STMicroelectronics and the mobile platform division of Ericsson will move forward as ST-Ericsson. This announcement follows the recent closing of the agreement announced in August 2008, between the parent companies, to merge Ericsson Mobile Platforms and ST-NXP Wireless.