Wireless

Panasonic Industry announces its cost-effective Wi-Fi 6 & Bluetooth LE Combo module series PAN W602, based on the Texas Instruments (TI) SimpleLink WiFi CC3301 companion IC and CC3351 Companion IC.

At embedded world 2025 in Nuremberg Germany from 11-13 March 2025 in Hall 3 on Stand 426, NeoCortec, manufacturer of ultra-low-power bi-directional wireless mesh networking protocol stack, and in Hall 3 on stand 639, Embit, manufacturer of wireless modules, will launch a dual band (subGHz/2.4GHz), embedded LoRa-enabled NeoMesh wireless network module and LoRaWAN stack.

Synaptics has extended its award-winning Veros triple combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0 and Bluetooth Low Energy (BLE), and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs).

This article will explore some of the solutions for IoT connectivity and sensors, development and deployment tools, as well as strategies for enhancing IIoT efficiency. Whether it’s enabling Cloud connectivity or retrofitting legacy systems, DigiKey and Würth Elektronik have the building blocks for a connected future.  

Keysight is collaborating with Capgemini to integrate and validate 5G new radio (NR) non-terrestrial networks (NTN) in both transparent and regenerative modes. This collaboration aims to accelerate Capgemini’s development of its 5G NR NTN ready radio access network (RAN) framework.

MathWorks and Altera, an Intel company, announced a collaboration to accelerate wireless development for Altera FPGAs by enabling wireless systems engineers to use AI-based autoencoders to compress Channel State Information (CSI) data and significantly reduce fronthaul traffic and bandwidth requirements.

Nordic Semiconductor collaborates with Deutsche Telekom to introduce an IoT solution aimed at enhancing global connectivity for embedded devices.

VVDN Technologies has announced a collaboration with Qualcomm Technologies to introduce its next-generation Wi-Fi 7 Access Point Reference Design. Powered by the Qualcomm Dragonwing NPro A7 Platform, this AI-driven reference design is built for customisable deployments.  

Cervoz has announces its new wide temperature Wi-Fi 6 module, MEC-WIFI-2042B-30W.

Kontron, Napatech, and Truminds Software Systems announced improved performance and energy efficiency for their previously released 5G core solution.