Scanning electron microscope zeros in on mask defects

With its high-accuracy, high-throughput defect review capability, the E5620 DR-SEM is expected to contribute appreciably to production quality improvements in next-generation photomasks and shorter mask manufacturing turnaround times.

Like its predecessor, the E5620 implements Advantest’s highly stable image capture technology to easily import defect location data from mask inspection systems and automatically image the locations. The system has a number of improvements specifically to target future mask requirements.

“In working with our customers to determine their requirements for the future EUV photomask inspection and analysis, we identified several essential advancements to integrate into our proven DR-SEM system,” said Toshimichi Iwai, senior VP of the Nanotechnology Business Group with Advantest. “With the E5620, our team of lithography experts has created a superior tool that can handle today’s photomasks and is truly future-ready for the coming EUV generation.”

E5620 Key New Features include:

• High Spatial Resolution
• Highly Stable, Fully Automatic Image Capture
• Compatible with Mask Inspection Systems
• Elemental Composition Analysis Option
• Backscattered Electron Analysis Option

The E5620 DR-SEM is available for purchase now.

Advantest will share further details regarding its new E5620 DR-SEM during SEMICON Japan 2022 in Tokyo (December 14-16).