Production
Saki launches SPI and AOI systems
17th February 2025
Caitlin Gittins
Saki has announced the launch of its latest 3Si/3Di-EX Series of 3D Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, set to begin shipping in April 2025.
Built on Saki's proven high-rigidity gantry structure, the 3Si/3Di-EX Series introduces a modular hardware design that allows for seamless optical unit upgrades, ensuring long-term adaptability to evolving inspection needs. With a shared gantry and a unified software interface, this system offers sustainability, efficiency, and superior usability for high-precision inspection.
The features of the system include:
- One programming: unified SPI and AOI inspection program data eliminates redundant setup and programming tasks
- Easy programming: simplified and automated program creation minimises operator workload and enhances productivity
- AI assist: reduces false positives through Hybrid AI-powered re-evaluation, improving efficiency and reducing operator workload even further
- AI OCR: AI-powered optical character recognition ensures stable character inspection despite variations in print quality and position, boosts productivity and eliminates the need for specialized skills
The 3Si/3Di-EX Series is engineered to maximise productivity, efficiency and quality control with advanced machine-to-machine (M2M) connectivity and full Smart Factory integration:
- Saki Link: seamlessly connects SPI and AOI systems, enabling real-time data sharing and optimised inspection flow. Centralised control across multiple inspection systems within a production line eliminates bottlenecks and improves quality control
These automation capabilities mean manufacturers can streamline their processes and achieve greater levels of operational efficiency.
