Production

The Chomerics Division of Parker Hannifin has released CHO-BOND 1018, a two-component, electrically conductive polythioether that acts as a fillet, gap filler or seam sealant for high level EMI/RFI shielding for today’s advanced electronic systems.

After a few harrowing years, the supply chain for electronic materials is bouncing back. Despite some lingering hiccups, the future of global logistics is brighter than ever, if we can successfully apply what we learned during the pandemic and build dynamic supply chains that can weather the storms to come.

Hubs has successfully helped GB MEC achieve efficiency gains by streamlining sourcing processes. 

Asked whether electronics is a ‘digital technology’, almost everyone would reply in the affirmative. However, while printed circuit boards (PCBs) enable digital technologies, the manufacturing processes used to produce them are still largely analogue.

XJTAG has announced a new release of its JTAG boundary scan tools that makes it quicker and easier to manage build variants.

It is estimated that over half of the printed circuit boards (PCBs) made today use no-clean solder paste during assembly. Some PCB fabricators believe that it speeds up the production process by removing the need for cleaning circuit boards after reflow.

Agriculture has undergone a revolution with the emergence of advanced technologies in agri-tech, and display and embedded technology in particular have played a pivotal role in enhancing efficiency, productivity, and sustainability in ways that were not possible before, in this fast-evolving industry.

Minebea Intec, a manufacturer of weighing and inspection technologies, will be presenting its products and innovations at interpack 2023.

Lenalea Electronics has been using 2D Automatic Inspection System technology for almost a decade and has now invested in the latest 3D AOI from Europlacer to support its expansion plans.

Bostik has extended its Born2Bond engineering adhesive HMPUR and UV-CIPG ranges to support the manufacture of smaller, more lightweight, and increasingly complex consumer electronic devices that are also required to be recyclable and meet all relevant sustainability and safety regulations.