Production

Test Research Inc (TRI) will be participating in the SMTA Guadalajara Expo 2024 to showcase its award-winning inspection solutions for the Surface Mount Technology (SMT) industry. 

Responding to the market trend of miniaturisation of electronic printed circuit boards, Seica has launched the COMPACT RT NEXT> SERIES, a fully automatic rotary table based system ideal for medium/high volume production.

MacDermid Alpha Electronics Solutions unveils the MICROFAB SC-40 PLUS. This next-generation, high-purity, high-speed copper plating process is engineered for semiconductor production.

XJTAG has released version 4.0 of its software suite, bringing speed increases both from streamlining the user interface and from increasing throughput of the JTAG chains under test.

Absolute EMS, an award-winning EMS provider of turnkey contract manufacturing services, is proud to offer world-class expertise in BGA (Ball Grid Array) assembly, setting new standards for quality, speed, and flexibility in the industry.

Leading semiconductor test equipment supplier Advantest has revealed the newest addition to its portfolio of power supplies for the V93000 EXA Scale SoC test platform.

The National Composites Centre, part of the High Value Manufacturing Catapult, has released a case study detailing their successful delivery of the design and manufacture of vital one-off flying parts to facilitate UK capability towards accelerating new technologies to decarbonise the aviation industry.

Investments and expansions at device, epiwafer, and wafer levels are driving growth in the multi-billion dollar SiC power market. Device manufacturers are constructing facilities in various regions.

Farnell has added Weller's five new WXsmart soldering station kits and two new accessories to provide professionals with a smart and safe solution for all their soldering needs.

There are many pieces to any semiconductor product ‘puzzle’ that can result in obsolescence. These pieces range from business revenue to any one of the subcomponents that compose semiconductor products, such as foundry process technologies, packages, substrate or lead frames, test platforms, or design resources.