Industrial

Tomorrow’s Engineers Week has kicked off with a series of films showcasing the engineers that are at the heart of solutions to achieve net zero by 2050.

Electrocomponents, omni-channel provider of product and service solutions, has announced 'For a better world', the group’s comprehensive and robust 2030 ESG (environmental, social, and governance) action plan to support a more sustainable and inclusive world.

With increasing pressure placed on engineers and manufacturers, there is an overriding urgency to improve the sustainability of their products while also meeting stringent cost and performance requirements. Out of this has sprung a drive to improve the capability of products through material innovation, where recent electric motor developments have brought weight saving and energy efficient solutions, as Richard Thompson, Commercial Director, Alv...

With make-or-break climate talks underway at COP26, Energy Monitor has launched the first in a trilogy of data-led articles offering a plant-by-plant analysis of the energy transition in the power sector.

Cervoz Technology will launch three more modular expansion cards as part of its embedded component offerings before the year is out.

Power Integrations (PI) has released a whitepaper that asks whether it is time for DC-DC converter to be replaced by a new power converter architecture.

LOBO Systems, the British firm producing a sophisticated scaffolding system, has won more than £600,000 worth of orders from Amazon.

NASA has carried out extensive ground vibration tests on its 'Maxwell' electric aircraft to simulate the stresses that the plane would experience during a real flight.

Kerlink, who specialise in solutions dedicated to the IoT, and Sensgreen, an IoT company focusing on indoor air-quality monitoring and smart-building solutiions, have announced their partnership, helping building owners ensure offices, schools, hotels, and shopping centres have clean air in comfortable indoor settings.

To facilitate chip innovation and enable designers to quickly achieve silicon success of complex high-performance computing (HPC) and mobile SoCs, Synopsys, today announced a collaboration with TSMC to develop a broad portfolio of Synopsys DesignWare Interface and Foundation IP on the TSMC N4P process.