TI introduces new integrated automotive chips

TI's AWRL6844 60GHz mmWave radar sensor supports features such as occupancy monitoring for seat belt reminder systems, child presence detection and intrusion detection with a single chip running Edge AI applications to create a safer driving environment.

With TI's audio DSP core, the AM275x-Q1 MCUs and AM62D-Q1 processors make premium audio features more affordable. Paired with TI’s latest analogue products, including the TAS6754-Q1 Class-D audio amplifier, engineers can take advantage of a complete audio amplifier system offering. TI is showcasing these devices at the 2025 Consumer Electronics Show (CES), Jan. 7-10, in Las Vegas, Nevada.

“Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences,” said Amichai Ron, Senior Vice President, TI Embedded Processing. “TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our Edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

Original equipment manufacturers (OEMs) are gradually designing in more sensors to improve the in-vehicle experience and meet evolving safety standards. TI’s Edge AI-enabled AWRL6844 60GHz mmWave radar sensor allows engineers to incorporate three in-cabin sensing features to replace multiple sensor technologies, such as in-seat weight mats and ultrasonic sensors, lowering total implementation costs by an average of US$20 per vehicle.

Furthermore, the AWRL6844 integrates four transmitters and four receivers, enabling high-resolution sensing data at an optimised cost for OEMs. This data feeds into application-specific AI-driven algorithms on a customizable on-chip hardware accelerator and DSP, improving decision-making accuracy and reducing processing time. The Edge intelligence capabilities of the AWRL6844 sensor that help improve the driving experience include the following examples:

• While driving, it supports occupant detection and localisation with 98% accuracy to enable seat belt reminders
• After parking, it monitors for unattended children in the vehicle, using neural networks that detect micromovements in real time with over 90% classification accuracy. This direct sensing capability enables OEMs to meet 2025 European New Car Assessment Program (Euro NCAP) design requirements
• When parked, it adapts to different environments through intelligent scanning, reducing false intrusion detection alerts caused by car shaking and external movement

As driver expectations grow for elevated in-cabin experiences across vehicle models, OEMs aim to offer premium audio while minimising design complexity and system cost. AM275x-Q1 MCUs and AM62D-Q1 processors reduce the number of components required for an automotive audio amplifier system by integrating TI's vector-based C7x DSP core, Arm cores, memory, audio networking and a hardware security module into a single, functional safety-capable SoC.

The C7x core, coupled with a matrix multiply accelerator, together form a neural processing unit that processes both traditional and edge AI-based audio algorithms. These automotive audio SoCs are scalable, allowing designers to meet memory and performance needs, from entry-level to high-end systems, with minimal redesign and investment.

TI’s next-generation C7x DSP core achieves more than four times the processing performance of other audio DSPs, enabling audio engineers to manage multiple features within a single core. AM275x-Q1 MCUs and AM62D-Q1 processors enable immersive audio inside the cabin with features such as spatial audio, active noise cancellation, sound synthesis and advanced vehicle networking, including Audio Video Bridging over Ethernet.

“Dolby’s longtime collaboration with Texas Instruments has enabled incredible audio experiences in the home, which we’re now bringing into the car,” said Andreas Ehret, Senior Director of Automotive Business at Dolby Laboratories. “With TI's C7x DSP core, we can now deliver the latest Dolby Atmos capabilities more efficiently, including support for even smaller form factor audio systems so nearly all vehicles can have Dolby Atmos. Together, these products can help turn every car ride into an immersive entertainment experience.”

To further optimise their automotive audio designs, engineers can use TI’s TAS6754-Q1 audio amplifier with 1L modulation technologyto deliver class-leading audio performance and power consumption, with half the number of inductors compared to existing Class-D amplifiers. The TAS67xx-Q1 family of devices, which integrates real-time load diagnostics required by OEMs, helps engineers simplify designs, decrease costs, and increase efficiency without sacrificing audio quality.