Renesas Electronics has introduced a new Bluetooth chip that combines a radio transceiver, an Arm M0+ microcontroller, memory, peripherals, and security features all in one compact SoC design.
The DA14533, the first automotive-qualified device in the company's Bluetooth Low Energy (LE) system-on-chip (SoC) portfolio, includes power management features to simplify system integration and reduce power consumption.
Its software stack is qualified against Bluetooth Core 5.3 and it offers support for extended temperatures, allowing developers to jump start projects in applications ranging from tyre pressure monitoring and keyless entry to wireless sensors and battery management systems.
This device builds on Renesas' know-how in Bluetooth LE SoCs (its SmartBond Tiny Family) with low-power consumption, including some of the most advanced power management features in the industry. The device includes an integrated DC-DC buck converter, which accurately adjusts the output voltage according to system requirements.
Active system power consumption is lower than comparable devices in the market, requiring only 3.1mA during transmission and 2.5mA during reception. In hibernation mode, the current drops to 500nA. These power management and power-saving features help to extend the operational life of small-capacity battery-powered systems and meet the stringent power requirements of tyre pressure monitoring systems’ mission profile.
The device is an AEC-Q100 Grade 2 qualified device, which means it has passed strict testing to sustain quality and reliability in harsh automotive environments. Additionally, the device’s extended temperature range (-40 to +105°C) ensures reliable performance in demanding conditions, making it well suited for automotive and industrial systems where stability and durability are essential. Qualified against Bluetooth Core 5.3 specifications, the device contains the latest security features to safeguard connected devices from various threats.
“Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date,” said Chandana Pairla, VP of Connectivity Solutions Division, Renesas. “This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems.”
Much like other Bluetooth LE SoC devices in the SmartBond Tiny family,the DA14533 only requires 6 external components, offering a best-in-class engineering bill of materials (eBOM).
A single external crystal oscillator (XTAL) is used for both active and sleep modes, eliminating the need for a separate oscillator for sleep mode. Its ultra-compact design – available in a WFFCQFN 22-pin 3.5 x 3.5 mm package – makes the device reportedly the smallest automotive Bluetooth LE SoC on the market. With its compact design and low eBOM, the device integrates seamlessly into space-constrained systems, reducing overall system costs and accelerating time-to-market for customers.
