Automotive
Atmel Launches Industry's First LIN Transceivers in DFN Packages to Enable Smaller Footprint
Atmel Corporation today announced the availability of two stand-alone LIN (local interconnect network) transceiver ICs in DFN packages. Compared to standard SO8 packages at 5mm x 6.5mm, the DFN14 package for the ATA6670 measures at 3mm x 4.5mm, while the DFN8 package for the ATA6663 measures at 3mm x 3mm, saving about 75 percent of the overall PCB area. Space and cost savings are critical for LIN bus networking applications such as automotive body electronic systems, including door modules, seat control, intelligent sensors or powertrain applications. Since both DFN packages are pin-compatible, customers can use either the single- or the dual-LIN transceiver on the same PCB design without any changes.
AtmeSimilar to all Atmel LIN family members, the new LIN devices are manufactured using Atmel's high-voltage BCD-on-SOI process, also known as SMART-I.S.™ technology, which is optimized for operations up to 40V for applications in harsh automotive environments. The results of manufacturing on the SMART-I.S. technology is industry-leading EMC robustness (EMC test and conformance test LIN2.1, Europe, and SAE J2602-2, US), and excellent ESD protection (exceeding 6kV).
Availability and Pricing
Samples of the ATA6670 and the ATA6663 are available now. Pricing starts at USD $0.45 (ATA6663) and USD $0.90 (ATA6670) for 10,000-piece quantities. To simplify and speed-up design-ins, evaluation kits are available for both devices starting at USD $50.00.