Automotive
Keysight and ADI partner to develop GMSLTM test methodology
Keysight Technologies and Analog Devices (ADI), a global semiconductor specialist, have collaborated to create a comprehensive test solution for Gigabit Multimedia Serial Link (GMSL2TM) devices.
Toshiba and MIKROE introduce motor driving board
Toshiba Electronics has partnered with MIKROE to integrate its Smart Motor Control Driver IC (SmartMCD) into the SmartMCD TB9M003FG board, streamlining prototyping phase for automotive applications.
There’s not a second to lose if the UK is to build a world-class battery industry
The Faraday Institution’s latest report on UK gigafactories finds that they could support 35,000 jobs by 2040, along with a further 65,000 in the supply chain, but warns that the UK is not moving quickly enough.
DENSO and Quadric sign AI semiconductor development agreement
DENSO and US startup Quadric have signed a development license agreement for a Neural Processing Unit (NPU), which is a semiconductor specialised for the arithmetic processing of AI.
Consumers see high potential for climate protection and sustainability
Digital technologies enable companies to effectively address sustainability goals. Even though there are some considerable differences in the acceptance and usage intensity of the smart home and smart mobility, consumers in Europe, the US, and Asia see similarly high potential for climate protection through digital technologies.
Cenex and FPS sign MoU with Korea for EV fleet safety
A co-operation has been established between UK (Cenex, FPS) and Korean (Thallos, Innoca, KETI, and KAATA) partners to evaluate opportunities for deploying smart city and smart grid enabled e-fleet and charger management platforms alongside cutting edge in-vehicle safety systems in the commercial vehicle sectors in both the UK and Korea.
Melexis announces new brake pedal position sensor
Melexis' MLX90424 is a cost-effective solution simplifying automotive brake pedal sensing.
NXP’s advanced Trimension UWB portfolio hits the road with Audi
NXP Semiconductors has announced that its Trimension NCJ29Dx family, part of one of the industry’s broadest UWB portfolios, is the technology foundation for Audi’s advanced new UWB platform, delivering the precise and secure real-time localisation required by leading premium car manufacturers to enable hands-free secure car access via smart mobile device and other UWB-based features.
Linux Foundation Energy EVerest Project joins Task 53
Bidirectional EV charging, or Vehicle-to-Grid (V2G), plays an essential role in the decarbonisation of the electricity sector. But there are still hurdles to overcome, e.g. lack of standardisation and insufficient interoperability. To improve interoperability of bidirectional charging, the Hybrid and Electric Vehicle Technology Collaboration Programme (HEV TCP) by the International Energy Agency (IEA) launched Task 53. In line with this goal, the...
Waste2Race: the sewage-powered race car on track to make history
Waste2Race, hydrogen-powered car fuelled by sewage is attempting to break a land speed record, driving sustainability in racing.