Automotive

As the electronic and software content in automobiles continues to increase, the need for fast, reliable communication between vehicle subsystems intensifies. To help address this networking design challenge, Freescale Semiconductor recently developed a high-performance microcontroller (MCU) based on its Power Architecture® technology in collaboration with leading automaker, the BMW Group. Freescale’s 32-bit MCU for BMW’s 2010 lux...

Achieving an Electric Vehicle industry first, ITT Interconnect Solutions has launched a new high efficiency, high reliability J1772 connector targeting electric vehicle charging applications and capable of performing Level I and II charging from a low end of 15A/120V to a high end range of 75A/240V through the same interface.

Maxim's new LNA, the MAX2180, integrates an AGC circuit to optimize car antenna reception while reducing solution size and cost.

International Rectifier has expanded its dedicated family of automotive-qualified power MOSFETs for applications requiring low on-state resistance (RDS(on)) including on-board power supplies and heavy loads on Internal Combustion Engine (ICE) platforms, micro and full hybrid platforms

STMicroelectronics today announced that its HD Radio Technology chipset, embedded in the Alps Electric module, has been certified by iBiquity Digital Corporation for meeting comprehensive performance requirements.

Infineon launched its new AUDO MAX family of 32-bit microcontrollers (MCUs) for automotive powertrain and chassis applications. The AUDO MAX family supports design of engine management systems meeting the strict Euro 5 and Euro 6 emission standards for combustion vehicles and enables the electrification of powertrain functions in electrical vehicles. Key features of the AUDO MAX family are maximum clock frequencies of up to 300MHz, high-speed in...

Analog Devices is introducing the industry’s first automotive grade products to provide true bidirectional isolation for the lower cost I2C serial bus. Based on ADI’s proprietary iCoupler® digital isolation technology, the ADuM1250W hot swappable, dual I2C digital isolator reduces board space by as much as 80 percent and greatly reduces the system cost associated with isolating I2C buses. This is accomplished by eliminating optocouplers a...

NXP announced the release of the UJA107xA family, its next generation of CAN/LIN System Basis Chips (SBCs) for in-vehicle networks. Offering enhanced EMC (Electromagnetic Compatibility) performance, the chips meet the stringent requirements of global car OEMs such as Audi, BMW, Daimler, Ford, Porsche, Renault, Toyota and Volkswagen.

At the third MOST Forum on April 5, 2011, in Frankfurt (Germany), Daimler AG will provide a summary of more than 10 years' experience in MOST development and give insight into the ongoing MOST150 integration procedure.

u-blox announces LEON-G100 Automotive, a surface-mount automotive quality grade GSM/GPRS modem. It is designed for use in first-mount car telematics applications such as emergency call (e.g. eCall), Stolen Vehicle Recovery and wireless driver assistance services. In addition, it is ideal for after-market applications including road pricing, wireless toll collection, pay-per-use insurance and AVL / fleet management systems.