Automotive

With the component E981.57, ELMOS introduces the first dual FlexRay star coupler available in series production worldwide, thus completing the FlexRay family. The IC has passed certification according to the latest FlexRay Electrical Physical Layer (EPL) specification V3.0. The E981.57 meets the car manufacturers’ requirements with respect to electromagnetic compatibility (EMC) and electrostatic discharge (ESD).

With the IC E521.30, ELMOS introduces an RGB LED system basic chip. The component features a fully integrated BSM (bus shunt method) auto addressing LIN transceiver. BSM represents a method for addressing participants in an LIN bus system that is robust and has been proven millions of times. The BSM auto addressing method has been established among the German OEMs e.g. in the field of HVAC flap motors and has been used for almost ten years across...

Renesas Electronics today announced the RH850/F1x Series of 32-bit microcontrollers for automotive body applications as the first products to be released in the RH850 Family of automotive MCUs with on-chip flash memory employing the industry's most advanced 40 nanometer process.

STMicroelectronics has revealed a new generation of ICs using an advanced manufacturing process that helps save energy, improve accuracy and simplify the design of sensors for applications from automotive electronics to smart buildings and industrial controls.

Renesas Electronics today announced 21 new 16-bit microcontroller (MCU) products in the RL78/D1A Group, including 48-pin versions, which are the industry’s smallest single-chip MCUs for two-wheeled vehicle meter applications. The new devices with packages ranging from 48 to 100 pins are designed for cost-sensitive meter control applications in two- and four-wheeled vehicles in various markets.

NXP Semiconductors N.V today announced the NCF2960 – the world’s smallest combo chip solution for automotive keyless entry with immobilizer functions. The compact solution uniquely integrates a security transponder, micro RISC kernel, and multi-channel radio transmitter in a single package. With this latest addition to its car access portfolio, NXP further enhances its position as the market-leading supplier of semiconductors for immobilizers...

LEM introduces the DVL series for insulated nominal voltage measurements in traction applications. This family of devices spans the range from 50-2000 VRMS and incorporates LEM’s proven and patented insulating technology. Despite achieving very high levels of isolation with a safety insulation voltage of 8.5 kV, the DVL transducer is compact, measuring only 137.8 x 63 x 64.3 mm. It is fully compatible with previous generations of transducers ...

Maxim Integrated Products, Inc introduces two, high-speed serialization/deserialization (SerDes) chipsets that significantly lower the costs for automotive camera systems. Operating over standard coax cables, the MAX9273/MAX9272 (22 bits) and MAX9271/MAX9272 (16 bits) chipsets do not need the extra wires of an Ethernet setup to power a camera. With today’s high-end automotive camera systems often using multiple cameras and cables, this coax sol...

Maxim Integrated Products, Inc today introduced five high-integration products for the Automotive and Factory Automation markets that dramatically improve operating efficiencies and reduce costs. Maxim also announced it has collaborated with two firms to produce a reference design for a highly integrated telehealth fitness (“Fit”) shirt that monitors vital signs, lowers the cost of medical diagnosis, and represents a new era in preventive med...

NXP today introduced the LFPAK56D portfolio – a range of dual Power-SO8 MOSFETs specifically designed for automotive applications such as fuel injection, ABS and stability control.