Automotive

TDK Corporation has expanded its leading portfolio of automotive-grade MLCCs with new mid-voltage types featuring C0G temperature characteristics and rated voltages from 100 V to 630 V. The new components in the CGA series offer capacitance values that are very high for C0G components. In particular, the IEC 5750 (EIA 2220) MLCC with dimensions of 5.7 mm x 5.0 mm has a capacitance of 100 nF and is rated for 630 V, which is the world’s highest v...

The Rail System Testing Laboratory at Hennigsdorf, Germany has validated REO UK’s BW155 range of braking resistors for corrosion resistance against salt mist and water spray as well as dust Ingress protection to IP65. The specific standards that the resistors were tested to are EN60068-2-52 for salt mist and EN60529 for Ingress Protection.

The automotive sector has driven a great deal of debug tool development in recent years, as no major brand wants to risk a recall, reliability issues or a catastrophic failure. By Barry Lock, UK Manager of Lauterbach.

Mitsubishi Electric Corporation will announce on Power Conversion Intelligent Motion (PCIM) Europe 2013 on May 14-16 in Nuremberg, Germany, the development of higher current rated intelligent power modules (IPMs) mainly for electric- (EV) and hybrid vehicle (HV) applications. Two new models of the J-Series in 3-phase inverter configuration (6 in 1) will be introduced, based on low-loss CSTBTTM chip technology.

Our Qorivva MPC560xB family of 32-bit MCUs are the latest in integrated devices available for automotive body electronics applications. These scalable devices built on Power Architecture technology are supported by an enablement ecosystem that includes the StarterTRAK TRK-MPC5606B development kit with software drivers, operating systems and configuration code to help you quickly implement your designs.

Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive application at a European based IDM. The patent pending ecoAmp is a state-of-the-art solution for high-power applications of 1000+ amperes.

Yamaichi Electronics enhanced its famous double shoulder contact IC500 Open Top series by a movable ground pin option matching QFP type IC packages with exposed pads. Equipment used in today’s modern life is taking over more and more smart functionalities that lead to a continuously increasing amount of embedded electronic components. At the same time, the trend for more compactness let IC packages become denser than ever.

Microchip Technology Inc today announced the expansion of its LIN portfolio with the LIN 2.1 and SAE J2602-2 compliant and low-power MCP2003A transceiver, MCP2021A, MCP2022A, MCP2025 and MCP2050 LIN System Basis Chips (SBCs), and PIC16F1829LIN System in Package (SiP). These devices include high integration options, such as a voltage regulator, windowed watchdog timer, battery monitor output and a MCU. Additionally, they feature high robustness,...

Mitsubishi Electric Corporation announced today that it has commercialized and delivered railcar auxiliary power supply systems that incorporate the world's first silicon carbide (SiC) power modules for actual use in operating trains. Systems now being installed for test operation in new Type 1000 railcars of Tokyo Metro's Ginza Line subway are scheduled to enter commercial operation in June.

NXP Semiconductors today announced availability of the TJA1083, TJA1085 and TJA1086 FlexRay transceivers. NXP now delivers the industry’s most comprehensive portfolio of FlexRay transceivers to the automotive market - offering OEMs a one-stop shop for their FlexRay networking designs. Fully compliant with JASPAR and EPL 3.0.1 certifications, NXP’s complete FlexRay portfolio is expected to further promote the adoption of FlexRay technology wit...