Automotive

The series of low-profile, high-current inductors from Vishay Intertechnology has been expanded to feature integrated e-shields for reduction of EMI with automotive grade devices in the 2525, 3232 and 4040 case sizes. The Vishay Dale IHLE-2525CD-5A, IHLE-3232DD-5A, and IHLE-4040DD-5A lower costs and save board space by eliminating the need for separate board-level Faraday shielding. 

A range of rail connectivity solutions will be exhibited by HUBER+SUHNER at this year’s InnoRail exhibition in India, including its RADOX portfolio. HUBER+SUHNER’s booth at InnoRail focuses on solutions for Connected Mobility – the notion that HUBER+SUHNER brings communications and railway together by providing instrumental components required to enable broadband network connections on board, from train-to-ground and t...

The portfolio of roof-top antennas from HUBER+SUHNER has expanded with the five port SENCITY Rail MIMO. Accompanying its established SENCITY Rail antenna portfolio, the robust five port MIMO roof-top antenna enables system integrators and rail vehicle manufacturers to upgrade their vehicles to 4G/LTE and WiFi MIMO with minimal installation effort required.

  Full-digital instrument panels that give a high-end feel to any car are coming to the mid and entry ranges, enabled by new technology from STMicroelectronics. ST's new Accordo 5 family of automotive processors meet crucial display-performance and security demands in a low-power compact platform suitable for lower-cost vehicles.

Railway applications require cases that are highly resilient. The POLYRACK TECH-GROUP secured the development contract from Siemens for 2,500 constructed case systems with integrated train protection components.

  CAF (Construcciones y Auxiliar de Ferrocarriles) has boosted its ability to reduce the noise generated by its trains, helping to make high-speed travel more viable for commuters and operators alike, with the latest beamforming technology.

Characterised by high levels of power density and integration, automotive electronics and highly integrated power electronic systems are increasingly being positioned in direct proximity to combustion engines. As a result the electronic components are subjected to significant combined electrical, thermal and mechanical loads.

The need for ESD protection in smartphones and automotive electronics is being driven by the demand for increased safety and reliability and to take the size of devices even smaller. CeraPad is the development from TDK Corporation, presented at electronica, an ultra-thin ceramic substrate that features integrated ESD protection within its multilayer structure and eliminates the need for discrete ESD components. 

Siemens WinCC OA has been selected to upgrade the SCADA system of the Heathrow rail link into the airport to increase reliability and availability. Passengers and staff using the rail link are set to benefit from Siemens technology, as part of a major upgrade project designed to optimise the efficiency of a transportation system first opened in 1998 to link the world’s busiest airport with Paddington station in central London.

A Safety Integrity Level 4 (SIL4) certification has been announced for Artesyn's Embedded Computing ControlSafe Expansion Box Platform with ControlSafe Expansion Box computer and ControlSafe EXB software. Certified by TÜV SÜD, this Commercial Off-The-Shelf (COTS) fail-safe and fault-tolerant computing platform is designed for a wide range of train control and rail signaling applications.