Industries

LPRS is delivering production quantities of its latest generation of wireless modules, easyRadio Advanced (eRA). Manufactured in the UK, eRA offers significant improvements over earlier generations of easyRadio products and incorporates the latest version of LPRS’s unique easyRadio software protocol. This removes the complexities of developing a software interface to the wireless modules, significantly reducing end product development times. T...

The Ember ZigBee EM35x InSight development kit can be used for EM351 and EM357 system-on-chips (SoC) based development. This kit is an integral part of the Ember InSight Development Environment, the premier embedded ZigBee wireless networking development platform, consisting of software and hardware tools that are the most comprehensive tools available for ZigBee product development

The Sensors & Instrumentation Knowledge Transfer Network (KTN) based in London, UK, has published an study titled Power Management Technologies to Enable Remote and Wireless Sensing which main focus is on establishing best practices and identifying remaining performance barriers in implementing self-powered wireless sensor networks.

Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced release 1.3 of its Lattice Diamond® design software, the flagship design environment for Lattice FPGA products.

Leoni now offers a solid aluminium conductor for the motor vehicle industry to wire the battery as an alternative to the common copper cable. It can be shaped in three dimensions and weighs only about half as much as the conventional component. Leoni will present this product for the first time at the IAA International Motor Show in Frankfurt, together with other lightweight construction solutions.

WOW Connections, expands its cellular product line with a compact TR-900C module, iWOW's first GSM/GPRS module with castellation form factor.

NXP Semiconductors announced the release of a new generation of automotive position sensors, KMA210. The KMA210 incorporates NXP’s latest magnetoresistive sensor chip and a unique signal conditioning ASIC developed in NXP’s advanced Silicon on Insulator (SOI) ABCD9 process technology. It is the first of a new magnetic sensor family in a full system-in-package solution that requires no external components. KMA210 is specially designed to impro...

Infineon Technologies has introduced a new series of Receive Front-End Modules for implementation of Global Navigation Satellite System (GNSS) functionality in Smart Phones and other handheld devices. The new BGM103xN7 Series devices are the first modules available that support separate or simultaneous reception of both Global Positioning System (GPS) and Globalnaya Navigatsionnaya Sputnikovaya Sistema (GLONASS) signals.

New Sidewinder™ reference design can provide a complete base station on a single PCB

DAN3300 single-SoC Platform for low-cost Picocell Access Points - As DesignArt Networks introduces its ground-breaking 40nm DAN3000 SoC family with the launch of five distinct SoC chips, the company today announced its third base station SoC platform – the DAN3300.