Industries

SMSC announced the USB553x, a family of USB 3.0 hub controllers consisting of 7-port and a 4-port offerings. These new SuperSpeed USB hubs deliver the industry's smallest footprint, hybrid speed configuration with an optimized BOM cost for designers of the emerging USB 3.0 ecosystem. The devices also feature programmable flexibility for configuration of performance enhancing features, and the ability to support 2-layer PCB designs. The USB553X fa...

SMSC announced two products offering the latest advancements in Hi-Speed USB 2.0 connectivity, the USB3750 and USB3740. These newest additions to SMSC's family of industry-leading Hi-Speed USB connectivity products are designed for portable devices and offer a compelling USB solution for mobile battery powered applications.

Atmel Corporation today announced the availability of two stand-alone LIN (local interconnect network) transceiver ICs in DFN packages. Compared to standard SO8 packages at 5mm x 6.5mm, the DFN14 package for the ATA6670 measures at 3mm x 4.5mm, while the DFN8 package for the ATA6663 measures at 3mm x 3mm, saving about 75 percent of the overall PCB area. Space and cost savings are critical for LIN bus networking applications such as automotive bod...

In a move to decrease capacitor failures related to board-flex cracking, Vishay Intertechnology today introduced its new VJ automotive series of surface-mount multilayer ceramic chip capacitors (MLCCs), available with optional polymer terminations designed to withstand higher levels of bending stress. The devices are offered with C0G (NP0) and X5R/X7R/X8R dielectrics, each with a wide range of case sizes, voltage ratings, and capacitance values.

A large range of new hardware accessories especially for commercial vehicles has been launched by EMKA in the form of a new “Commercial-Vehicles” brochure which details locks, latches, handles, hinges and gasketing now available for vehicles from horse boxes to railway rolling stock.

Linear Technology Corporation annonce la nouvelle version, de grande fiabilité (classe MP), du LT3512, un régulateur à récupération d'énergie, monolithique, isolé, de forte tension, qui fonctionne sur une gamme de la température de jonction de – 55°C à 150°C. Ce composant simplifie la conception d’un convertisseur DC/DC isolé. Le LT3512 ne nécessite pas de photocoupleur ni d’un troisième enroulement, ni d’un transformateur ...

Toshiba announced it will launch a single chip IC that is compliant with the TransferJet standard for close proximity wireless transfer technology. Samples will start shipping at the end of January 2012 and mass production is scheduled to begin in the second quarter (April-June) of 2012.

Integrated Device Technology, Inc. has announced the industry’s most flexible Universal Frequency Translators (UFTs) with industry-leading phase noise performance. The devices are easy to configure and allow for output frequencies that are not limited by the traditional integer or fractional multiples of the input frequency, for use in a myriad of high-performance applications, including communications line cards, networking interfaces, embedde...

Broadcom Corporation unveiled a new family of NFC chips designed to drive the mass deployment of NFC in consumer electronics devices. With a powerful combination of power, size and functional requirements, the new chips provide the advanced capabilities required by OEMs to ignite NFC adoption in consumer electronics. Visit Broadcom.com for more news from the show

SemiSouth Laboratories, Inc., fabricant majeur de transistors en carbure de silicium (SiC) pour conversion et gestion d’énergie à forte puissance et haut rendement en milieu difficile, lance de nouvelles diodes 1200 V / 5 A en boîtier compact DPAK (TO-252) pour montage en surface, qui apporte la distance de sécurité nécessaire et n’exige pas de broche centrale.