Industries
Microchip lance des microcontrôleurs 8 bits avec logique configurable intégrée en boitiers 6 à 20 broches
Microchip annonce ses nouveaux microcontrôleurs (MCU) PIC® 8 bits en boitiers 6 à 20 broches, dotés d'une ou plusieurs cellules logiques configurables et d'un haut niveau d'intégration des périphériques. Les microcontrôleurs PIC10F(LF)32x et PIC1xF(LF)150x sont chacun dotés de nouveaux périphériques, tels que les cellules logiques configurables (CLC), les générateurs de formes d'ondes complémentaires (CWG) et les oscillateurs à co...
Ericsson étend sa ligne de régulateurs à montage vertical pour applications à surface critique
Ericsson introduit deux nouveaux membres à montage vertical dans sa famille de régulateurs numériques de point de charge (POL) 3E pour applications à surface critique. Les BMR462-SIP (BMR4622002) de 12 A et BMR463-SIP (BMR4632002) de 20 A complètent le BMR464-SIP (BMR4642002) de 40 A récemment introduit et offrent aux concepteurs la possibilité de sélectionner le module convenant le mieux à leur configuration.
SMSC Introduces Industry's First 7-Port USB 3.0 Hybrid Hub Controller Family
SMSC announced the USB553x, a family of USB 3.0 hub controllers consisting of 7-port and a 4-port offerings. These new SuperSpeed USB hubs deliver the industry's smallest footprint, hybrid speed configuration with an optimized BOM cost for designers of the emerging USB 3.0 ecosystem. The devices also feature programmable flexibility for configuration of performance enhancing features, and the ability to support 2-layer PCB designs. The USB553X fa...
SMSC Introduces Small Footprint, USB 2.0 Switches with Multiplexing, Port Protection & Battery Charger Detection
SMSC announced two products offering the latest advancements in Hi-Speed USB 2.0 connectivity, the USB3750 and USB3740. These newest additions to SMSC's family of industry-leading Hi-Speed USB connectivity products are designed for portable devices and offer a compelling USB solution for mobile battery powered applications.
Atmel Launches Industry's First LIN Transceivers in DFN Packages to Enable Smaller Footprint
Atmel Corporation today announced the availability of two stand-alone LIN (local interconnect network) transceiver ICs in DFN packages. Compared to standard SO8 packages at 5mm x 6.5mm, the DFN14 package for the ATA6670 measures at 3mm x 4.5mm, while the DFN8 package for the ATA6663 measures at 3mm x 3mm, saving about 75 percent of the overall PCB area. Space and cost savings are critical for LIN bus networking applications such as automotive bod...
Vishay Intertechnology’s VJ Automotive Series Surface-Mount MLCCs Available With Polymer Terminations to Reduce Failures Related to Board-Flex Cracking
In a move to decrease capacitor failures related to board-flex cracking, Vishay Intertechnology today introduced its new VJ automotive series of surface-mount multilayer ceramic chip capacitors (MLCCs), available with optional polymer terminations designed to withstand higher levels of bending stress. The devices are offered with C0G (NP0) and X5R/X7R/X8R dielectrics, each with a wide range of case sizes, voltage ratings, and capacitance values.
Hardware Accessories For Commercial Vehicles From EMKA
A large range of new hardware accessories especially for commercial vehicles has been launched by EMKA in the form of a new “Commercial-Vehicles” brochure which details locks, latches, handles, hinges and gasketing now available for vehicles from horse boxes to railway rolling stock.
Régulateur à récupération d'énergie, monolithique, 100V, isolé, sans photocoupleur, fonctionnant avec une température de jonction de – 50°C à 150°C
Linear Technology Corporation annonce la nouvelle version, de grande fiabilité (classe MP), du LT3512, un régulateur à récupération d'énergie, monolithique, isolé, de forte tension, qui fonctionne sur une gamme de la température de jonction de – 55°C à 150°C. Ce composant simplifie la conception d’un convertisseur DC/DC isolé. Le LT3512 ne nécessite pas de photocoupleur ni d’un troisième enroulement, ni d’un transformateur ...
Toshiba Launches Wireless IC Compliant with TransferJetTM Close Proximity Wireless Transfer Technology
Toshiba announced it will launch a single chip IC that is compliant with the TransferJet standard for close proximity wireless transfer technology. Samples will start shipping at the end of January 2012 and mass production is scheduled to begin in the second quarter (April-June) of 2012.
IDT Expands Timing Leadership with Ultra-Flexible Frequency Translation Devices Featuring Industry-Leading Phase Noise Performance
Integrated Device Technology, Inc. has announced the industry’s most flexible Universal Frequency Translators (UFTs) with industry-leading phase noise performance. The devices are easy to configure and allow for output frequencies that are not limited by the traditional integer or fractional multiples of the input frequency, for use in a myriad of high-performance applications, including communications line cards, networking interfaces, embedde...