Industries
TMUX582F-SEP: Your Shield in Space
The TMUX582F-SEP is a modern 8:1 multiplexer suitable for single ended operation. This latch-up immune device offers robust overvoltage protection up to +60V making it optimal for harsh space environments. Additionally, this protection operates in powered-on, powered-off, and floating supply conditions.
How motion capture technology is shaping the future of drone swarms
Drone swarms have been growing in popularity alongside the rise of drone technology itself, now, motion capture technology is being utilised to further this research.
Soft wearable robot tested for Parkinson's support
Earlier this year researchers from the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) and the Boston University Sargent College of Health & Rehabilitation Services tested a soft, wearable robot to assist a person living with Parkinson’s walk without freezing.
Infineon launches new gate driver
Infineon is launching the new MOTIX TLE9189 gate driver IC for safety-critical applications for 12V brushless DC (BLDC) motors.
Texas Instruments brings you the latest in Aerospace
Here, you’ll find a selection of the latest news, products, and articles from Texas Instruments focused on the Aerospace industry.
Innoscience adds new GaN devices to portfolio
Innoscience Technology has expanded its portfolio with two 100V automotive-grade GaN devices.
Vishay introduces new series of thermistors
Vishay Intertechnology recently introduced a new series of inrush current limiting positive temperature coefficient (PTC) thermistors.
Northrop Grumman creates worlds first flying data centre
Northrop Grumman recently unveiled its Deep Sensing and Targeting (DSaT) technology, which transforms aircraft into flying data centres, enabling real-time intelligence gathering from satellites and drones to assist military operations.
Faster space communication with record-sensitive receiver
In space exploration, long-distance optical links can now be used to transmit images, films, and data from space probes to Earth using light. But in order for the signals to reach all the way and not be disturbed along the way, hypersensitive receivers and noise-free amplifiers are required.
ESCATEC’s UV enhanced die bonder technology
Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.