INA2180A3QDGKRQ1

SN74LVC1G3157 Single-Pole, Double-Throw Analog Switch

LMT87-Q1 LMT87-Q1 - 1.5V, SC70, Analog Temperature Sensor with Class-AB Output

The TLIN1029-Q1 is a Local Interconnect Network (LIN) physical layer transceiver with integrated wake-up and protection features, compliant to LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A and ISO/DIS 17987–4.2 standards. LIN is a single wire bidirectional bus typically used for low speed in-vehicle networks using data rates up to 20 kbps. The TLIN1029-Q1 is designed to support 12 V applications with wider operating voltage and additional bus-fault protection. The LIN receiver supports data rates up to 100 kbps for in-line programming. The TLIN1029-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus signal using a current-limited wave-shaping driver which reduces electromagnetic emissions (EME). The receiver converts the data stream to logic level signals that are sent to the microprocessor through the open-drain RXD pin. Ultra-low current consumption is possible using the sleep mode which allows wake-up via LIN bus or pin. The integrated resistor, ESD and fault protection allows designers to save board space in their applications.

Features:

• AEC-Q100 Qualified for Automotive Applications
  • Device Temperature: –40°C to 125°C Ambient
  • Device HBM Certification Level: ±8 kV
  • Device CDM Certification Level: ±1.5 kV
• Compliant to LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A and ISO/DIS 17987–4.2
• Conforms to SAEJ2602 Recommended Practice for LIN
• Supports 12 V Applications
• LIN Transmit Data Rate up to 20 kbps.
• Wide Operating Ranges
  • 4 V to 36 V Supply Voltage
  • ±45 V LIN Bus Fault Protection
• Sleep Mode: Ultra-Low Current Consumption Allows Wake-Up Event From:
  • LIN Bus
  • Local Wake up through EN
• Power Up and Down Glitch Free Operation
• Protection Features:
  • Under Voltage Protection on V_SUP
  • TXD Dominant Time Out Protection (DTO)
  • Thermal Shutdown Protection
  • Unpowered Node or Ground Disconnection Failsafe at System Level.
• Available in SOIC (8) Package and Leadless VSON (8) Package with Improved Automated Optical Inspection (AOI) Capability

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