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Advantest Europe GmbH

Advantest Europe GmbH Articles

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Test & Measurement
20th June 2012
Hua Hong NEC Advantest Co-Develop Wafer-Level High Parallelism Multi-Site Test Solution RFID Devices

Shanghai Hua Hong NEC Electronics Company, Ltd. and Advantest Corporation have collaborated to successfully develop a wafer-level, multi-site parallel test solution for radio-frequency identification semiconductor devices that meet industry-standard ISO 14443 guidelines.

Test & Measurement
6th June 2012
Advantest Announces 3D TSV Stack Test Solutions

Advantest Corporation today announced that a new product line of fully automated and integrated test and handling solutions for TSV based 2.5D and 3D products is under development. The concept model test cell dubbed, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities.

Test & Measurement
6th June 2012
Advantest Announces Memory Test System T5811

Advantest Corporation today announced its new memory test system, the T5811, targeting DRAM memory core test. Available from July 2012, the T5811 reduces power consumption by 90% and floor-space requirements by two-thirds, compared to previous models, and is upgradable via a simple exchange of components.

Test & Measurement
6th June 2012
Advantest to Launch CloudTesting Service in Fall 2012

Advantest Corporation today announced that it will launch a new test solution, dubbed CloudTesting Service (CTS), which utilizes cloud computing technology to offer cutting-edge test technology for semiconductor device R&D and design applications.

Test & Measurement
31st May 2012
Advantest Ships 100th V93000 Smart Scale Test System in Product Line’s First 10 Months

Just ten months after launching its Smart Scale generation of testers, Advantest Corporation has shipped its 100th V93000 Smart Scale system, capable of scalable, highly cost-efficient testing of IC designs for the 28 nm technology node and beyond.

Analysis
30th May 2012
Advantest Expo 2012 Visit the Leading Edge of the Future

Advantest Corporation today announced that its quadrennial corporate exhibition, Advantest Expo 2012, will be held at the Tokyo International Forum on June 6th—7th, 2012. The event will showcase Advantest’s present and future with numerous tools and equipment displays, as well as keynote speeches and seminars exploring the diverse sectors where Advantest has a presence. Attendance is expected to include the general public as well as industry ...

Test & Measurement
15th May 2012
Advantest Introduces T5511 High-Speed Memory Test System Offering Multi-functionality and Industry’s Top Test Speed of 8Gbps

Advantest Corporation announced the availability of its next-generation high-speed DRAM test system, the T5511. The new system, which begins shipping this month, offers the industry’s fastest test speed of 8Gbps.

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