Advanced Thermal Solutions, ATS, now provides a family of ultra-high performance heat sinks for cooling high powered CPUs, GPUs, FPGAs and AI processors. This ultra-cool family includes active heat sinks with integral blowers, and passive heat sinks that use available airflow to provide thermal management. 

Advanced Thermal Solutions, a company focused on the thermal management of electronics, and Richardson RFPD have announced a new distribution partnership. The new line of ATS cold plates will be available through Richardson RFPD, adding a reliable, high-performance liquid cooling solution for the distributor’s power electronics customers.

Thermal engineering and manufacturing company focused on the thermal management of electronics, Advanced Thermal Solutions, has announced its new line of tube-to-fin, liquid-to-air heat exchangers, one of an array of liquid cooling products that ATS offers. ATS heat exchangers are made with what the company claim to be the industry’s highest density fins to maximise heat transfer from liquid to air, allowing the liquid to be cooled to ...

  On 15th December ATS will host a free, online webinar on 'Thermal Management of Medical Electronics'. The hour-long webinar will begin at 2:00PM ET, and there will be 30 minutes of question and answer time after its completion.

Advanced Thermal Solutions now provides a family of high performance maxiFLOW heat sinks for cooling DC/DC power converters and power modules. The power brick heat sinks are available for full, half, quarter and one-eighth brick sizes. With proper thermal management, brick DC/DC converters can be used at their maximum operating temperature for optimum performance on PCBs.

Advanced Thermal Solutions (ATS) now provides the base-and-stem Candlestick sensor for simultaneously measuring air temperature and velocity when characterising thermal conditions inside electronic systems. The Candlestick sensor is narrow and low profile, in heights of 9, 12 and 20mm. These features minimise the disturbance of airborne heat flow in the test domain for more precise measurements.

  Advanced Thermal Solutions has introduced the QuadFLOW fansink, which uses directed airflow in multiple fin fields to cool electronic components up to 30% more effectively than the liquid cooling methods currently deployed in 1 and 2U commercial servers.

The ATVS-2020 scanner from Advanced Thermal Solutions measures airflow temperature and velocit. It accommodates up to 32 sensors for precise, multi-point field mapping of test domains, including housings and PCB surfaces. The result is a highly accurate thermal characterisation.

Advanced Thermal Solutions, ATS, now uses advanced die casting technology to produce heat sinks that cool stadium lighting and other large scale outdoor lighting systems. At the site of the 2015 Super Bowl (XLIX) in Glendale, Arizona, cast metal heat sinks from ATS helped cool the high output LED lighting around the University of Phoenix Stadium.

Advanced Thermal Solutions has introduced clipKIT, a heat sink attachment system available exclusively from Digi-Key that can be used with most industry standard, off the shelf straight fin, pin fin, cross cut or slant fin heat sinks. The system improves on heat sink performance in thermal transfer, and vibration and shock resistance.

Advanced Thermal Solutions' Zipper Fin heat sinks protect components from the dangers of excess heat, at low cost. Zipper fins are machined from thin sheet metal, typically aluminium or copper, and are formed into custom shapes. The sheets are designed to interlock with a narrow space between their layers. The fin assembly is wave soldered to a metal base, forming a rigid, light heat sink.

The widest choice of push pin-mounted heat sinks for cooling BGAs and other hot components is being offered by Advanced Thermal Solutions (ATS), which provides 108,000 possible configurations. The company offers more than 200 heat sinks with push pin mounting. Geometries include straight fin, cross-cut, and ATS maxiFLOW spread fin geometries.

ATS has introduced a series of portable Chiller Systems and liquid-to-air Heat Exchangers for controlling fluid temperatures in looped liquid cooling systems.

The newly-released ATS-0345 portable vane anemometer from Advanced Thermal Solutions measures air flow speed, volumetric flow rate, and temperature. The hand-held anemometer provides precise measurements for automotive, aerospace and HVAC studies, fume hoods, air ducts, wind tunnels, and marine applications.

The iQ-200 instrument measures the temperatures of solid materials and surrounding air, while also tracking air velocity and air pressure. Measurements are taken simultaneously at multiple points to accurately profile heat sinks, PCBs and card racks for testing and characterisation. Developed by Advanced Thermal Solutions, (ATS), the laboratory-grade instrument simultaneously captures thermal data from up to 12 thermocouples which can be J, K, T ...

The series of Star LED heat sinks has been expanded by Advanced Thermal Solutions. Designed for convection cooling of high heat flux LEDs, each of the 32 heat sinks provides enhanced heat transfer for effective LED cooling without fans or blowers. Cooling performance reaches more than 60 K (∆Ths-ambient) at 50.0 W of power dissipation, depending on model.

Advanced Thermal Solutions has today announced the launch of the new FSC-200 Fan Speed Controller, providing precise management of fan speeds during thermal management studies of electronic devices. Featuring ATS stageSPEED software, the FSC-200 allows the use of a PC to incrementally control the speed of fan and fan trays from 0 to 100% of their maximum power.

Advanced Thermal Solutions has added to its line of maxiGRIP attachment systems for fast, secure mounting of heat sinks to flip chips, BGAs and other hot PCB components. More than 200 variations of maxiGRIP are now available for use on a wide variety of IC packages.

Advanced Thermal Solutions have today announced the release of the new CLWT-115 research quality, closed loop wind tunnel from Advanced Thermal Solutions provides an accurate and convenient system for thermally characterizing PCBs, heat sinks and components at controlled temperatures from ambient to 85°C (185°F).

Advanced Thermal Solutions, Inc., has developed a heat sink design calculator, as an iPhone app, that identifies the proper heat sinks to solve most component-level cooling issues. The app allows engineers to input the essential specs and then research online for heat sinks that fit their requirements.