Manufacturer of PC board connectors and semiconductor sockets, Advanced Interconnections (AIC), has announced the successful recertification of its quality management system to the newest ISO 9001 Standard. ISO 9001:2015 is focused on consistently meeting customer and regulatory requirements while striving for process improvement and risk abatement.

Designer and manufacturer of interconnect solutions for the global electronics industry, Advanced Interconnections, has recently published a new video highlighting how to quickly build an application-specific connector part number with its Build-A-Part tool. The video offers a quick tutorial for using the online product configurator’s easy-to-use parametric search menus to build an IC Socket, Adapter, or Board-to-Board Connector part number...

Extending its line of Mezza-pede SMT connectors, Advanced Interconnections has reduced board stack height by 15% with a lower profile header (model DHAL). The innovative design features a thin insulator, at 0.025" (0.63mm) – half the thickness of the original header design.

A broad array of customised, board-to-board connector capabilities will be highlighted by Advanced Interconnections Corp at electronica 2016 in Munich from 8th-11th November. Advanced will be co-located with local authorised distributor RTS connect on Stand B3.536.

Advanced Interconnections has completed the International Traffic in Arms Regulations registration process with the U.S. Department of State, Directorate of Defense Trade Controls. ITAR registration is required for any U.S. company to manufacture controlled defense articles and is a precondition to apply for an export license or exemption.

Advanced Interconnections will feature a broad array of customized connector capabilities at electronica 2012 in Munich from 13-16 November. In addition to the company’s standard SMT and thru-hole board-to-board connectors, application-specific designs will be showcased, ranging from large, shrouded solutions for high-reliability board stacking to micro flex cable-to-board connectors.

Unique solder perform terminals from Advanced Interconnections Corp. (Advanced) reduce assembly costs by eliminating time-consuming steps in PC board processing.

Advanced Interconnections Corp. (Advanced) recently passed a comprehensive ISO audit, successfully earning recertification for its quality management system to the ISO 9001:2008 Standard.

A new line of customized surface mount connectors from Advanced Interconnections reduces board space by utilizing the perimeter of circular and other odd-shaped PC boards. To support prototypes and small volume runs, Advanced can provide an affordable design and rough sample for electrical and mechanical testing, typically in less than 5 days.

Mezza-pede SMT Connectors from Advanced Interconnections Corp. are now available with 36 positions. Designed for 1mm pitch micro board-to-board and flex cable-to-board applications, the low profile Mezza-pede Connector system has passed the mixed flowing gas (MFG) test and is especially suited for high reliability applications from military to medical and other demanding environments.

The new Mod5 Series Flip-Top BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs.

Advanced Interconnections Corp. (Advanced) was recently recognized for its quality and performance by Raytheon Integrated Defense Systems. Advanced received the 2009 Supplier Excellence Award at a ceremony held on March 2, 2010. Raytheon recognizes its suppliers based on three important factors: on-time delivery measures, sustained performance on quality, and commitment to continuous process and quality improvement. Advanced was recognized for ac...

For applications that require low profile and customizable PCB configurations, Peel-A-Way Removable Terminal Carriers are the perfect solution for device socketing and board-to-board interconnect. Compared to traditional molded insulators, the ultra-thin, .005 (0.13mm) polyimide film carrier, employing near flush solder tail terminals (Type -210), reduces component height above the PC board by as much as 80%, down to .015 (0.38mm). For board-to-b...

Mezza-pede SMT Connectors from Advanced Interconnections are now available with 36 positions. Designed for 1mm pitch micro board-to-board and flex cable-to-board applications, the low profile Mezza-pede Connector system has passed the mixed flowing gas (MFG) test and is especially suited for high reliability applications from military to medical and other demanding environments.

The B2B High Density SMT Connector line from Advanced Interconnections Corp. is now available in a 19.05mm (.750 inch) mated height. Designed for high pin count and high density 1.27mm pitch board to board applications where durability and reliability are critical, such as servers and routers, the newest member of the B2B SMT Connector series is available in 8 and 10 row configurations from 240 to 500 positions.

The Mezza-pede 1mm SMT Connectors from Advanced Interconnections Corp. are designed for 1mm pitch micro board-to-board and flex cable-to-board applications. The screw-machined, low profile Mezza-pede Connector system is especially suited for high reliability applications such as providing power to a tunable laser since this connector passes mixed flowing gas (MFG) tests, ensuring continuous performance in the field.

In addition to traditional single-, dual-, triple-row and grid array patterns, Advanced Interconnections Corp. now offers its extensive line of Peel-A-Way removable terminal carriers in nonlinear configurations.