Adeia was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on May 28-31, 2024. Find more industry awards, here.

Adeia have announced that it is showcasing its hybrid bonding technology at the Chiplet Summit on 6th to 8th February 2024, at the Santa Clara Convention Centre. 

Adeia research has found an increased demand for AI chipsets which will spur requirements for hybrid bonding technology across the semiconductor industry.

Adeia, the company whose patented innovations enhance billions of devices, has announced that Kioxia Corporation, a global specialist in flash memory and solid-state drives, entered into a long-term agreement to license Adeia’s semiconductor patent portfolio, including those relating to hybrid bonding.

Adeia, the company whose patented innovations enhance billions of devices, has announced that Western Digital, a global specialist in data storage solutions, entered into a long-term agreement to license Adeia’s semiconductor patent portfolio, including those relating to hybrid bonding.