Frequency

Up/down converters suit satcoms, radar applications

9th May 2018
Mick Elliott
0

The ADMV10x Converters from Analog Devices are in stock at Mouser Electronics. Part of ADI’s latest series of RF up/down converters, these monolithic microwave integrated circuits (MMIC) are manufactured using gallium arsenide (GaAs), and offer designers a high performance product in a small, convenient package for a variety of audio and video data transmission applications.

The converters use an I/Q mixer topology to reduce the need for unwanted sideband filtering.

The series consists of the ADMV1009, the ADMV1010, the ADMV1011 and the ADMV1012.

The ADMV1009 is a single sideband (SSB) I/Q upconverter optimised for point-to-point microwave radio designs that operate in the 12.7GHz to 15.4GHz frequency range.

The device provides 21dB of conversion gain with 20dB of image rejection, and its upconversion requires only a 180-degree balun to select the required sideband.

The comparable SSB I/Q downconverter for the ADMV1009 is the ADMV1010, which is optimised for the 12.6GHz to 15.4GHz frequency range.

In contrast to the ADMV1009, this device provides 15dB of conversion gain with 25dB of image rejection, and its downconversion requires a 90-degree hybrid to select the required sideband.

Both the ADMV1009 and ADMV1010 serve as a much smaller alternative to hybrid-style SSB upconverter and downconverter assemblies, respectively.

The ADMV1011 upconverter features the same conversion gain and image rejection as the ADMV1009 but outputs across a higher frequency range of 17 to 24GHz.

It is also fully integrated, needing a only 90-degree hybrid to select the required sideband.

The downconverter counterpart to the ADMV1011 is the ADMV1012, which operates in the 17.5GHz to 24GHz input frequency range and provides 15dB of conversion gain, 25dB of image rejection, and a 2.5dB noise figure.

Both the ADMV1011 and ADMV1012 function as a much smaller alternative to hybrid style DSB assemblies, each eliminating the need for wire bonding by allowing the use of surface-mount manufacturing assemblies.

The devices are delivered in a compact, thermally enhanced 4.9 mm × 4.9 mm LCC package.

They are suited for RF applications such as satellite communications, radar, electronic warfare systems, and point-to-point radios.

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