Chipset delivers transition from 100 to 400G in data centres

To meet the bandwidth demands, resiliency and data redundancy requirements of today’s Cloud data centres, data centre optical interconnects are transitioning from 100 to 400G, driving explosive demand for high-speed optical links.

MACOM’s demonstration shows the platform’s PAM-4 CWDM4 capability of uncooled operation at 400G at distances up to two kilometres on single mode fibre. These devices leverage key MACOM technologies optimised for high port density applications in Cloud data centre applications. The demonstration will transmit 100G PAM-4 over a single lambda with the L-PIC platform at OFC 2017.

“We have moved quickly to leverage the proven success achieved with EFT lasers to other platforms. Using EFT, we enabled the seamless integration of the TOSA optical path including lasers, monitor diodes, modulators and multiplexers onto a single chip, yielding the industry’s first silicon Photonic Integrated Circuit (PIC) integrated with self-aligning lasers (L-PIC) for 100G,” said Arlen Martin, Director of Product Marketing, Silicon PICs, Lightwave Networking Components, at MACOM. “By solving the key challenge of aligning lasers to the silicon PIC, maintaining high yield and high coupling efficiency, MACOM is making the adoption of silicon PICs a reality for the high-speed, high density optical interconnects demanded by Cloud data centres OEMs.”

MACOM’s L-PIC device combines four high-performance Distributed Feedback (DFB) laser diodes using MACOM’s patented Etched Facet Technology (EFT), four 28G Mach-Zehnder optical modulators integrated with a coarse wavelength division multiplexer, monitor photodiodes and a high-performance output coupler for operation on one standard single mode fibre. Using MACOM’s patented self-aligning etched facet technology (SAEFT) for precision attachment of the lasers to the SiPh L-PIC, this device enables customers to bypass optimizing optical coupling with active alignment and curing, offering instead an integrated single device that reduces manufacturer assembly time and component cost.

The MAOP-L284CN L-PIC transmitter is available as part of a complete MACOM chipset platform, including the MAMF-011095 silicon PIC controller and the MASC-37053A high-speed, low-power modulator driver. Optimised to work together, this chipset solution offers customers improved performance, eliminates the need for assembly of discrete components, reduces configuration and test costs, and accelerates time to market. With the recent acquisition of AppliedMicro and their PAM-4 technology, MACOM is extending the L-PIC transmitter platform to support 200G and 400G switch-to-fibre applications.

MACOM will feature demonstrations of its L-PIC based CWDM4 chipset solution and 100G over a PAM-4 single lambda on the L-PIC platform at OFC 2017, Booth #1736, March 19^th to 23^rd in Los Angeles, CA.