UBM-free WLCSP technology targets MAX 10 FPGAs

8th April 2015

Altera Europe

Siobhan O'Gorman

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An UBM-free WLCSP technology that provides enhanced quality, reliability and integration for Altera’s MAX 10 FPGA products has been developed by Altera and TSMC. This approach results in a thin package height of less than 0.5mm (including solder ball), which is suitable for applications where space is at a premium.

Other benefits include a better than 200% improvement in board-level reliability compared to standard WLCSP, while enabling a large die size envelope and high package I/O count, targeting applications such as WLAN and PMICs. Copper routing capability and inductor performance are also enhanced.

Altera’s MAX 10 FPGA products revolutionise non-volatile integration by delivering advanced processing capabilities in a single-chip, small-form-factor programmable logic device. Building upon the single-chip heritage of previous MAX device families, densities range from 2K to 50K logic elements, using either single or dual-core voltage supplies. MAX 10 FPGA devices are built on TSMC’s 55nm embedded NOR flash technology, which enables instant-on functionality.

“Altera’s work with TSMC has produced a very advanced and integrated packaging solution for MAX 10 devices,” said Bill Mazotti, Vice President, Worldwide Operations and Engineering, Altera. “Leveraging this innovative technology to improve integration, quality and reliability makes MAX 10 FPGA products more versatile and useful for our customers.”

Altera is currently sampling MAX 10 FPGA products with the WLCSP packaging. There are 81-pin and 36-pin WLCSP packages available.