VOICE 2018 calls for papers

18th September 2017

Mick Elliott

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An international call for papers has been announced by Advantest for the VOICE 2018 Developer Conference focusing on innovative test solutions for system-on-chip (SoC) and memory semiconductor devices, handler solutions, best practices and hot topics. The 2018 conference will return to the 2016 host cities of San Diego, CA and Hsinchu, Taiwan on May 15-16 and on May 23, respectively, under the unifying theme “Measure the Connected World…and Everything in It.”

For the past 11 years, VOICE has been an engineering conference, created by test engineers for test engineers. It will again offer attendees learning and sharing opportunities with technical presentations, keynote speakers, a partners’ exposition, a technology kiosk showcase and social gatherings in both locations.

“In 2018, VOICE attendees will have the opportunity to return to two of their favourite locations – San Diego, California and Hsinchu, Taiwan,” said Angelina Lemon, i.MX test engineer – senior principal engineer at NXP Semiconductors and VOICE 2018 chairperson. “We also are returning to an even richer technical program format that features high-quality sessions covering timely topics and more networking time to discuss these topics. In the last year, we have seen huge steps made in 5G communications, artificial intelligence and autonomous vehicles, which also create new challenges for automated testing. VOICE brings together different perspectives and expertise about these challenges and more. This event provides an environment that is perfect for sharing knowledge that attendees can apply immediately in their daily work. I look forward to welcoming Advantest users and partners to VOICE 2018.”

Advantest’s VOICE 2018 call for papers focuses on six technology tracks:

Device/System Level Test – specific devices and system level test; MIMO; mmWave; next-generation embedded processors; broadband fibre to the home; autonomous vehicles IC test; multi-chip system-in-package
Internet of Things (IoT) – IoT enabling technologies; mobility, 5G, wireless, RF, wearables; smart cities/homes; sensors; tactile internet
Test Methodologies – supporting standards and protocols; solutions for the latest testing challenges
Hardware & Software Design Integration -- utilising the latest hardware or software features; test cells; new test system enhancements
Optimising Productivity – cost of test; throughput; time-to-market; semiconductor “supercycle”
Hot Topics – new market drivers and future trends; artificial intelligence; smart data innovation; secure ID and cyber security; secure cloud; video streaming/telepresence

Test developers can submit their abstracts to be considered for presentation in California, Taiwan or both locations. All submissions must be received by October 20, 2017.