Viscom’s S3088 SPI will be part of SMTAI
Viscom announced that its S3088 SPI system will be featured in the SMTA International, National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from 29th to 30th September, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.
The S3088 SPI combines the advantages of the market-leading AOI system with powerful 3D SPI sensor technology and inspects the solder paste deposits with the highest possible speed and precision. Even the most demanding assemblies with CSPs or micro BGAs and pad sizes of 01005 are reliably inspected. All essential 3D features such as volume, height and form are recorded and checked, as are surface area, displacement and smearing. Additionally, Viscom´s FastFlow Handling provides extremely high throughput. Viscom’s TrueYield and its unique quality Uplink provide best-of-class defect inspection with optimal first-pass yield.
The Solder Joint Automatic Inspection Experience will include AOI inspection of PCBAs for open joints, lifted leads, partial lifting of passives and other less common defects. A series of test boards have been specially created with known process defects to show the machines' capabilities. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.
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