The programme: digital additive and/or 3D electronics

This article focuses on the theme of digital additive and 3D electronics, highlighting talks, masterclasses, and tours from organisations such as Airbus, Semikron Danfoss, Ceradrop, NeoTech AMT GmbH, Hasselt University, Karlsruhe Institute of Technology, Hahn-Schickard Institute, PERC, Binghamton University, University of Texas El Paso, and Tecnalia.

This is the second article on the theme of additive and 3D electronics. The previous piece discussed contributions from the European Space Agency, Yole Group, Decathlon, LPKF Laser and Electronics, Exxelia Micropen, Fuji Corp, Elephant, Nano OPS, Notion Systems, Henkel, Tecna-Print, Printed Electronics Ltd, ImageXpert, and Quantica.

Airbus will share insights into the durability of 3D printed and hybrid electronics under aeronautic conditions, with a focus on integrating electronics into composite structures. The presentation will discuss the durability of flexible hybrid electronics embedded in TPU foils within aeronautic composite coupons, alongside test results on additively manufactured electronics. This is significant due to the current lack of information in this area.

Semikron Danfoss will address the complexity of additive electronics for users and designers by classifying materials and processes from an application perspective. The talk will identify tools, methods, and materials necessary for both simple and complex additive manufacturing electronics (AME) projects. The aim is to lower the barriers to commercial adoption, making this an essential contribution for users, designers, hardware, and software vendors, including those outside the AME industry.

Ceradrop’s talk will focus on enabling industrialisation through digital printed electronics processes. This is critical as many applications are moving from prototyping to mass production, a transition that can be challenging. Ceradrop will showcase how its equipment solutions facilitate a seamless transition, with specific use cases highlighted.

Neotech AMT GmbH will present on combining free-form, five-axis 3D printing of mechanical and electronic components, surface mount device (SMD) placement, and pre- and post-processing techniques. This advanced form of 3D printed electronic technology offers design freedom, local production, and the potential to create sustainable mechatronic systems. The company will also showcase a 3D-printed lighting product.

PERC, one of the leading centres for printed electronics R&D in the US, will discuss additive manufacturing for advanced microwave and RF applications. The presentation will cover challenges in additive manufacturing of high-frequency electronics, such as UV-curable low-loss dielectric, resistive, and ferroelectric inks. It will also present examples of additive packaging, including a non-planar multi-material MMIC structure, bare-die integration, tuneable frequency selective surface (FSS) filters, wearable metasurface filters, and printed connectors.

The University of Texas El Paso will explore the integration of functional content into mass-customised structures, creating true 3D-printed electronics. The presentation will review underlying technology developments and provide examples of multi-process 3D printing, including consumer-anatomy-specific wearable electronics, electromechanical actuation, and electromagnetics in ceramic structures.

Hahn-Schickard Institute will introduce a hybrid printing system that directly prints polymer/dielectric substrates using fused filament fabrication (FFF) technology. The StarJet technology integrates into the 3D printing system as a second extruder, which prints bulk metal (e.g., SAC305 solder) through digital, non-contact deposition of molten metal droplets. This method achieves bulk electrical conductivity and high compatibility with flexible substrates. The use of bulk solder in molten metal printing allows direct soldering of SMD components onto large-area flexible substrates, eliminating the need for a solder reflow process.

Karlsruhe Institute of Technology will showcase a novel Aerosol-on-Demand (AoD) jet-printing system that addresses challenges in traditional digital printing of electronics. This system generates aerosol from a point source within the printhead and focuses it hydrodynamically, allowing the printing of discontinuous microstructures without ink loss or the need for a shutter. The technology shows promise for 2D, 2.5D, and 3D electronics printing.

Tecnalia Research and Innovation will discuss composite functionalisation through printing, which adds value to fibre-reinforced plastics. This talk will cover how advances in printing and manufacturing technologies enable the integration of electronic functionality into composites without compromising their properties, with specific demonstrators provided.

Hasselt University will present on thermoformed 3D electronics, with a focus on screen printing conductive silver-based inks on 2D foils and thermoforming them to create 3D circuit layers. The process and the different foils and inks will be discussed, along with the subsequent placement of rigid electronics using pick-and-place and conductive adhesives.

Exhibition

The exhibition offers an opportunity to connect with partners across the entire value chain, including equipment manufacturers, ink and paste formulators, print houses, and more. Over 80 exhibitors from around the world will participate.

Key players developing equipment, materials, and services for additive (digital) and 3D electronic printing include Notion Systems, Voltera, Heraeus Printed Electronics, ImageXpert, Printed Electronics Limited, IDS, Hummink, Fuji, MAAS, Neotech AMT, Nano Ops, Quantica, SüssMicrotec, XTPL, Atlant 3D, Ceradrop, DoMicro, Exxelia, Teca Print, and PrintedUp Institute, BotFactory, among others.